Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11305372 | Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials | Lea Di Cioccio | 2022-04-19 |
| 9449896 | Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method | Sandrine Lhostis, Olga Kokshagina, Vincent Fiori | 2016-09-20 |
| 9165861 | Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structure | Pierre Bar, Simon Gousseau | 2015-10-20 |