Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081463 | Bonding method with electron-stimulated desorption | Frank Fournel, Vincent Larrey, Sylvain Maitrejean | 2021-08-03 |
| 10957539 | Method for bonding by direct adhesion | Frank Fournel, Vincent Larrey, Marwan Tedjini | 2021-03-23 |
| 10818500 | Method for wafer trimming | Franck Fournel, Marc Zussy | 2020-10-27 |
| 10755967 | Method for transferring a useful layer | Hubert Moriceau | 2020-08-25 |
| 10727106 | Method for transfer of a useful layer | Hubert Moriceau | 2020-07-28 |
| 10651032 | Method for producing an epitaxial layer on a growth plate | Hubert Moriceau, Matthew Charles | 2020-05-12 |
| 10497609 | Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates | Frank Fournel, Hubert Moriceau, Francois Rieutord | 2019-12-03 |
| 9922954 | Method for performing direct bonding between two structures | Hubert Moriceau, Frank Fournel | 2018-03-20 |
| 9427948 | Manufacturing a flexible structure by transfers of layers | Hubert Moriceau, Maxime Argoud, Frank Fournel, Frédéric Mazen | 2016-08-30 |
| 9219004 | Method of fabricating polymer film in the cavity of a wafer | Hubert Moriceau, Maxime Argoud, Marc Zussy | 2015-12-22 |
| 9209068 | Method for the treatment and direct bonding of a material layer | Hubert Moriceau, Franck Fournel, Caroline Rauer | 2015-12-08 |
| 8382933 | Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water | Frank Fournel, Hubert Moriceau, Pierre Perreau | 2013-02-26 |
| 8318586 | Nitrogen-plasma surface treatment in a direct bonding method | Laure Libralesso, Hubert Moriceau, Francois Rieutord, Caroline Ventosa, Thierry Chevolleau | 2012-11-27 |
| 8302278 | Method and device for separating a structure | Marc Zussy, Lea Di Cioccio, Hubert Moriceau | 2012-11-06 |
| 7781300 | Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas | Hubert Moriceau, Franck Fournel | 2010-08-24 |
| 7541263 | Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized | Hubert Moriceau, Marc Zussy, Jerome Dechamp | 2009-06-02 |
| 7476595 | Method for the molecular bonding of microelectronic components to a polymer film | Hubert Moriceau, Lea Di Cioccio | 2009-01-13 |
| 7235461 | Method for bonding semiconductor structures together | Christophe Maleville, Corinne Maunand Tussot, Olivier Rayssac, Sebastien Kerdiles, Benjamin Scarfogliere +1 more | 2007-06-26 |
| 7232739 | Multifunctional metallic bonding | Sebastien Kerdiles, Fabrice Letertre, Hubert Moriceau | 2007-06-19 |
| 7229898 | Methods for fabricating a germanium on insulator wafer | Konstantin Bourdelle, Fabrice Letertre, Bruce Faure, Chrystel Deguet | 2007-06-12 |
| 7189632 | Multifunctional metallic bonding | Sebastien Kerdiles, Fabrice Letertre, Hubert Moriceau | 2007-03-13 |