Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112976 | Pseudo-substrate with improved efficiency of usage of single crystal material | Oleg Kononchuk | 2024-10-08 |
| 10910256 | Pseudo-substrate with improved efficiency of usage of single crystal material | Oleg Kononchuk | 2021-02-02 |
| 10672746 | Integrated circuit formed from a stack of two series-connected chips | Domenico Lo Verde, Laurent Guillot | 2020-06-02 |
| 10002763 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Bruno Ghyselen, Olivier Rayssac | 2018-06-19 |
| 9041165 | Relaxation and transfer of strained material layers | Bruce Faure, Pascal Guenard | 2015-05-26 |
| 8991673 | Substrate cutting device and method | Olivier Rayssac | 2015-03-31 |
| 8951887 | Process for fabricating a semiconductor structure employing a temporary bond | Didier Landru | 2015-02-10 |
| 8759881 | Heterostructure for electronic power components, optoelectronic or photovoltaic components | Jean-Marc Bethoux, Chris Werkhoven, Ionut Radu, Oleg Kononchuck | 2014-06-24 |
| 8679946 | Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate | Hubert Moriceau, Bernard Aspar, Eric Jalaguier | 2014-03-25 |
| 8679942 | Strain engineered composite semiconductor substrates and methods of forming same | Jean-Marc Bethoux, Alice Boussagol | 2014-03-25 |
| 8541290 | Optoelectronic substrate and methods of making same | Bruce Faure | 2013-09-24 |
| 8507361 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Bruno Ghyselen, Olivier Rayssac | 2013-08-13 |
| 8492244 | Methods for relaxation and transfer of strained layers and structures fabricated thereby | Pascal Guenard, Bruce Faure, Michael R. Krames, Nathan Gardner, Melvin McLaurin | 2013-07-23 |
| 8486771 | Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same | Bruce Faure, Michael R. Krames, Nathan Gardner | 2013-07-16 |
| 8487295 | Semiconductor structures and devices including semiconductor material on a non-glassy bonding layer | — | 2013-07-16 |
| 8481409 | Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate | Hubert Moriceau, Bernard Aspar, Eric Jalaguier | 2013-07-09 |
| 8481408 | Relaxation of strained layers | Carlos Mazure, Michael R. Krames, Melvin McLaurin, Nathan Gardner | 2013-07-09 |
| 8461014 | Methods of fabricating semiconductor structures and devices with strained semiconductor material | — | 2013-06-11 |
| 8343782 | Semiconductor device having an InGaN layer | — | 2013-01-01 |
| 8252664 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Bruno Ghyselen, Olivier Rayssac | 2012-08-28 |
| 8216368 | Method of fabricating an epitaxially grown layer | Bruce Faure | 2012-07-10 |
| 8154022 | Process for fabricating a structure for epitaxy without an exclusion zone | Chantal Arena | 2012-04-10 |
| 8114754 | Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods | — | 2012-02-14 |
| 8093687 | Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer | Olivier Rayssac | 2012-01-10 |
| 8083115 | Substrate cutting device and method | Olivier Rayssac | 2011-12-27 |