EJ

Eric Jalaguier

CEA: 15 patents #180 of 7,956Top 3%
ST S.O.I. Tec Silicon On Insulator Technologies: 3 patents #49 of 155Top 35%
CS Cnrs-Centre National De La Recherche Scientifique: 1 patents #33 of 140Top 25%
CN CNRS: 1 patents #3,857 of 11,908Top 35%
SO Soitec: 1 patents #140 of 259Top 55%
UF Université Joseph Fourier: 1 patents #66 of 284Top 25%
UA Universite Grenoble Alpes: 1 patents #96 of 431Top 25%
Overall (All Time): #265,979 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
12382845 Method for manufacturing resistive memory cells Nicolas Guillaume, Serge Blonkowski, Christelle Charpin-Nicolle 2025-08-05
11711927 Filamentary type non-volatile memory device Gabriele Navarro, Nicolas Guillaume, Serge Blonkowski, Patrice Gonon 2023-07-25
10297641 Memory device Christelle Charpin-Nicolle, Luca Perniola, Ludovic Poupinet, Boubacar Traore 2019-05-21
10002769 Method for functionalizing a solid substrate, other than a substrate made of gold, via specific chemical compounds Julien Buckley, Xavier Chevalier, Guy Royal 2018-06-19
8940623 Process for obtaining an array of nanodots Guillaume Gay, Thierry Baron 2015-01-27
8865548 Method of making a non-volatile double gate memory cell Christelle Charpin-Nicolle 2014-10-21
8679946 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Hubert Moriceau, Bernard Aspar, Fabrice Letertre 2014-03-25
8481409 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Hubert Moriceau, Bernard Aspar, Fabrice Letertre 2013-07-09
7906362 Assembling two substrates by molecular adhesion Guy Feuillet, Hubert Moriceau, Stephane Pocas, Norbert Moussy 2011-03-15
7829927 Polyoxometallates in memory devices Gerard Bidan 2010-11-09
7645684 Wafer and method of producing a substrate by transfer of a layer that includes foreign species Fabrice Letertre, Yves Mathieu Le Vaillant 2010-01-12
7535115 Wafer and method of producing a substrate by transfer of a layer that includes foreign species Fabrice Letertre, Yves Mathieu Le Vaillant 2009-05-19
7208392 Creation of an electrically conducting bonding between two semi-conductor elements Claude Jaussaud, Roland Madar 2007-04-24
7031578 Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said device Francois Marion, Jean-Charles Souriau 2006-04-18
7008859 Wafer and method of producing a substrate by transfer of a layer that includes foreign species Fabrice Letertre, Yves Mathieu Le Vaillant 2006-03-07
6974759 Method for making a stacked comprising a thin film adhering to a target substrate Hubert Moriceau, Bernard Aspar, Fabrice Letertre 2005-12-13
6362077 Structure comprising a thin layer of material made up of conductive zones and insulating zones and a method of manufacturing such a structure Bernard Aspar, Michel Bruel 2002-03-26