Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002842 | Method of producing a hybridized device including microelectronic components | — | 2018-06-19 |
| 9985067 | Method of manufacturing a plurality of island-shaped dipoles having self-aligned electrodes | — | 2018-05-29 |
| 9793141 | Hybrid electronic device protected against humidity and method of protecting a hybrid electronic device against humidity | Tony Maindron | 2017-10-17 |
| 9406662 | Flip-chip assembly process comprising pre-coating interconnect elements | Alexis Bedoin, Frédéric BERGER, Alain Gueugnot | 2016-08-02 |
| 9368473 | Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method | — | 2016-06-14 |
| 9166338 | Connecting elements for producing hybrid electronic circuits | Baptiste Goubault de Brugiere, Stéphane Lagarrigue, Marion Volpert, Michel Heitzmann | 2015-10-20 |
| 8898896 | Method of making a connection component with hollow inserts | Damien Saint-Patrice | 2014-12-02 |
| 8735819 | Detector system with an optical function and method for making such a system | Manuel Fendler, Gilles Lasfargues | 2014-05-27 |
| 8664778 | Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method | — | 2014-03-04 |
| 8329311 | Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patterns | Cécile Davoine | 2012-12-11 |
| 8291586 | Method for bonding two electronic components | — | 2012-10-23 |
| 8272556 | Metal lip seal and machine fitted with same seal | — | 2012-09-25 |
| 8252363 | Method of thinning a block transferred to a substrate | — | 2012-08-28 |
| 8168478 | Method for producing a matrix of individual electronic components and matrix produced thereby | Olivier Gravrand | 2012-05-01 |
| 8097827 | Method for soldering two elements together using a solder material | — | 2012-01-17 |
| 8093728 | Connection by fitting together two soldered inserts | — | 2012-01-10 |
| 8058656 | Method for producing a matrix of individual electronic components and matrix produced thereby | Olivier Gravrand | 2011-11-15 |
| 7938311 | Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method | — | 2011-05-10 |
| 7772041 | Method of sealing or welding two elements to one another | — | 2010-08-10 |
| 7759261 | Method for producing layers located on a hybrid circuit | Philippe Rambaud, Lydie Mathieu | 2010-07-20 |
| 7717718 | Electric component having microtips and ductile conducting bumps | Cécile Davoine | 2010-05-18 |
| 7691735 | Method for manufacturing metal chips by plasma from a layer comprising several elements | Laurent Grenouillet, Jonathan Garcia, Nicolas Olivier, Marion Perrin | 2010-04-06 |
| 7645686 | Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit | Manuel Fendler, Abdenacer Ait-Mani, Alain Gueugnot | 2010-01-12 |
| 7569940 | Method and device for connecting chips | — | 2009-08-04 |
| 7524704 | Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam | — | 2009-04-28 |