Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12162748 | Electromechanical microsystem | Laurent Mollard, Stephane Nicolas | 2024-12-10 |
| 11999613 | Electromechanical microsystem | Laurent Mollard, Stephane Nicolas | 2024-06-04 |
| 10644067 | RF/DC decoupling system for RF switches based on phase change material | Bruno Reig, Alexandre Leon | 2020-05-05 |
| 10532924 | Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer | Arnoldus Den Dekker, Marcel Giesen, Gudrun Henn, Jean-Louis Pornin, Bruno Reig | 2020-01-14 |
| 10529515 | Switch including a phase change materials based structure where only one part is activatable | Gabriele Navarro, Alexandre Leon, Vincent PUYAL, Bruno Reig | 2020-01-07 |
| 10414648 | Method of making a closed cavity comprising a flap protecting the cavity when it is closed | Bruno Reig | 2019-09-17 |
| 9934922 | Commutator structure comprising several channels of phase change material and interdigitated control electrodes | Bruno Reig, Alexandre Leon, Gabriele Navarro, Vincent PUYAL | 2018-04-03 |
| 9908773 | Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole | Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn, Jean-Louis Pornin +1 more | 2018-03-06 |
| 9199839 | Method of hermetically sealing a hole with a fuse material | Jean-Louis Pornin, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn +1 more | 2015-12-01 |
| 9003654 | Method for metalizing blind vias | Fabrice Jacquet, Sébastien Bolis | 2015-04-14 |
| 8898896 | Method of making a connection component with hollow inserts | Francois Marion | 2014-12-02 |
| 8674489 | Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same | Sébastien Bolis, Fabrice Jacquet | 2014-03-18 |
| 8482130 | Interconnect structure comprising blind vias intended to be metalized | Sébastien Bolis, Fabrice Jacquet | 2013-07-09 |
| 8470184 | Method for making a cavity in the thickness of a substrate which may form a site for receiving a component | Sébastien Bolis, Fabrice Jacquet | 2013-06-25 |