GH

Gudrun Henn

EA Epcos Ag: 6 patents #74 of 606Top 15%
CEA: 3 patents #1,381 of 7,956Top 20%
SN Snaptrack: 3 patents #25 of 213Top 15%
QU Qualcomm: 1 patents #7,512 of 12,104Top 65%
Overall (All Time): #503,691 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10532924 Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer Damien Saint-Patrice, Arnoldus Den Dekker, Marcel Giesen, Jean-Louis Pornin, Bruno Reig 2020-01-14
10076035 Miniaturized multi-part component and method for producing same Marcel Giesen 2018-09-11
9991873 Microacoustic component and method for the production thereof Bernhard Bader 2018-06-05
9908773 Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole Damien Saint-Patrice, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Jean-Louis Pornin +1 more 2018-03-06
9876158 Component comprising stacked functional structures and method for producing same Thomas Metzger 2018-01-23
9807917 Electronic component and method for producing the electronic component 2017-10-31
9590163 Electronic component and method for producing the electronic component Edgar Schmidhammer 2017-03-07
9199839 Method of hermetically sealing a hole with a fuse material Jean-Louis Pornin, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Bruno Reig +1 more 2015-12-01
9071222 Method for forming an electrode Andreas Link, Rainer Braun 2015-06-30
8940359 Method of producing a microacoustic component Christoph Eggs, Werner Ruile, Guenter Scheinbacher, Siegfried Menzel, Mario Spindler 2015-01-27