Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406662 | Flip-chip assembly process comprising pre-coating interconnect elements | Francois Marion, Alexis Bedoin, Frédéric BERGER | 2016-08-02 |
| 7645686 | Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit | Manuel Fendler, Abdenacer Ait-Mani, Francois Marion | 2010-01-12 |