Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7645684 | Wafer and method of producing a substrate by transfer of a layer that includes foreign species | Fabrice Letertre, Eric Jalaguier | 2010-01-12 |
| 7535115 | Wafer and method of producing a substrate by transfer of a layer that includes foreign species | Fabrice Letertre, Eric Jalaguier | 2009-05-19 |
| 7378729 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu | 2008-05-27 |
| 7256075 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu | 2007-08-14 |
| 7187162 | Tools and methods for disuniting semiconductor wafers | Sebastien Kerdiles | 2007-03-06 |
| 7008859 | Wafer and method of producing a substrate by transfer of a layer that includes foreign species | Fabrice Letertre, Eric Jalaguier | 2006-03-07 |