Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7602046 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Bruno Ghyselen, Cecile Aulnette, Takeshi Akatsu, Bruce Faure | 2009-10-13 |
| 7378729 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Cecile Aulnette, Yves Mathieu Le Vaillant, Takeshi Akatsu | 2008-05-27 |
| 7375008 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Bruno Ghyselen, Cecile Aulnette, Takeshi Akatsu, Bruce Faure | 2008-05-20 |
| 7256075 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Bruno Ghyselen, Cecile Aulnette, Takeshi Akatsu, Yves Mathieu Le Vaillant | 2007-08-14 |
| 7033905 | Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means | Bruno Ghyselen, Cecile Aulnette, Yves-Mathieu Vaillant, Takeshi Akatsu | 2006-04-25 |
| 7018910 | Transfer of a thin layer from a wafer comprising a buffer layer | Bruno Ghyselen, Cecile Aulnette | 2006-03-28 |
| 7008857 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Cecile Aulnette, Yves-Mathieu Vaillant, Takeshi Akatsu | 2006-03-07 |
| 6991956 | Methods for transferring a thin layer from a wafer having a buffer layer | Bruno Ghyselen, Cecile Aulnette, Nicolas Daval | 2006-01-31 |
| 6908774 | Method and apparatus for adjusting the thickness of a thin layer of semiconductor material | Bruno Ghyselen, Cecile Aulnette | 2005-06-21 |