Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7033905 | Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu | 2006-04-25 |
| 7008857 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu | 2006-03-07 |