Issued Patents All Time
Showing 25 most recent of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417942 | Process for hydrophilically bonding substrates | Vincent Larrey, Francois Rieutord, Jean-Michel Hartmann, Frank Fournel, Didier Landru +1 more | 2025-09-16 |
| 12198975 | Semiconductor on insulator structure for a front side type imager | Walter Schwarzenbach, Ludovic Ecarnot | 2025-01-14 |
| 12142517 | Method for transferring a useful layer from a donor substrate onto a support substrate by applying a predetermined stress | Didier Landru, Nadia Ben Mohamed | 2024-11-12 |
| 12143093 | Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device | Marcel Broekaart, Thierry Barge, Pascal Guenard, Ionut Radu, Eric Desbonnets | 2024-11-12 |
| 12112976 | Pseudo-substrate with improved efficiency of usage of single crystal material | Fabrice Letertre | 2024-10-08 |
| 12108678 | Hybrid structure for a surface acoustic wave device | Eric Butaud, Eric Desbonnets | 2024-10-01 |
| 12002697 | Method for detecting the splitting of a substrate weakened by implanting atomic species | Francois Rieutord, Frédéric Mazen, Didier Landru, Nadia Ben Mohamed | 2024-06-04 |
| 12002690 | System for fracturing a plurality of wafer assemblies | Didier Landru, Nadia Ben Mohamed | 2024-06-04 |
| 11923239 | Structures for radiofrequency applications and related methods | Eric Desbonnets, Ionut Radu, Jean-Pierre Raskin | 2024-03-05 |
| 11881429 | Method for transferring a useful layer onto a support substrate | Didier Landru, Nadia Ben Mohamed | 2024-01-23 |
| 11876015 | Method for transferring a useful layer to a carrier substrate | Didier Landru, Nadia Ben Mohamed, Franck Colas | 2024-01-16 |
| 11855120 | Substrate for a front-side-type image sensor and method for producing such a substrate | Walter Schwarzenbach, Ludovic Ecarnot, Christelle Michau | 2023-12-26 |
| 11711065 | Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device | Marcel Broekaart, Thierry Barge, Pascal Guenard, Ionut Radu, Eric Desbonnets | 2023-07-25 |
| 11670540 | Substrates including useful layers | Didier Landru, Nadia Ben Mohamed, Frédéric Mazen, Damien Massy, Shay Reboh +1 more | 2023-06-06 |
| 11626319 | Semiconductor-on-insulator substrate for rf applications | Arnaud Castex | 2023-04-11 |
| RE49365 | Structure for radio-frequency applications | William Van Den Daele, Eric Desbonnets | 2023-01-10 |
| 11424156 | Removable structure and removal method using the structure | Didier Landru, Nadia Ben Mohamed, Rénald Guerin, Norbert Colombet | 2022-08-23 |
| 11367650 | Structures for radiofrequency applications and related methods | Eric Desbonnets, Ionut Radu, Jean-Pierre Raskin | 2022-06-21 |
| 11335847 | Hybrid structure for a surface acoustic wave device | Eric Butaud, Eric Desbonnets | 2022-05-17 |
| 11295950 | Structure comprising single-crystal semiconductor islands and process for making such a structure | David Sotta, Jean-Marc Bethoux | 2022-04-05 |
| 11282889 | Substrate for a front-side-type image sensor and method for producing such a substrate | Walter Schwarzenbach, Ludovic Ecarnot, Christelle Michau | 2022-03-22 |
| 11276605 | Process for smoothing the surface of a semiconductor-on-insulator substrate | Didier Landru, Nadia Ben Mohamed | 2022-03-15 |
| 11251265 | Carrier for a semiconductor structure | Christophe Figuet, Kassam Alassaad, Gabriel Ferro, Véronique Souliere, Christelle Veytizou +1 more | 2022-02-15 |
| 11219851 | Vertical furnace with device for trapping contaminants | Didier Landru | 2022-01-11 |
| 11127624 | Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager | Walter Schwarzenbach, Ludovic Ecarnot | 2021-09-21 |