Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417942 | Process for hydrophilically bonding substrates | Vincent Larrey, Francois Rieutord, Jean-Michel Hartmann, Frank Fournel, Didier Landru +1 more | 2025-09-16 |
| 12344524 | Methods of fabricating semiconductor structures including cavities filled with a sacrificial material | Mariam Sadaka | 2025-07-01 |
| 12198975 | Semiconductor on insulator structure for a front side type imager | Walter Schwarzenbach, Oleg Kononchuk | 2025-01-14 |
| 12148755 | Front-side-type image sensor | Walter Schwarzenbach, Manuel Sellier | 2024-11-19 |
| 12100727 | Method for manufacturing a substrate for a front-facing image sensor | Walter Schwarzenbach, Damien Massy, Nadia Ben Mohamed, Nicolas Daval, Christophe Girard +1 more | 2024-09-24 |
| 11876020 | Method for manufacturing a CFET device | Walter Schwarzenbach, Nicolas Daval, Bich-Yen Nguyen, Guillaume Besnard | 2024-01-16 |
| 11855120 | Substrate for a front-side-type image sensor and method for producing such a substrate | Walter Schwarzenbach, Oleg Kononchuk, Christelle Michau | 2023-12-26 |
| 11282889 | Substrate for a front-side-type image sensor and method for producing such a substrate | Walter Schwarzenbach, Oleg Kononchuk, Christelle Michau | 2022-03-22 |
| 11205702 | Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit | Christophe Figuet, Bich-Yen Nguyen, Walter Schwarzenbach, Daniel Delprat, Ionut Radu | 2021-12-21 |
| 11127624 | Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager | Walter Schwarzenbach, Oleg Kononchuk | 2021-09-21 |
| 11127775 | Substrate for front side type imager and method of manufacturing such a substrate | Walter Schwarzenbach, Oleg Kononchuk, Christelle Michau | 2021-09-21 |
| 11114314 | Method for fabrication of a semiconductor structure including an interposer free from any through via | Bich-Yen Nguyen, Nadia Ben Mohamed, Christophe Malville | 2021-09-07 |
| 10777447 | Method for determining a suitable implanting energy in a donor substrate and process for fabricating a structure of semiconductor-on-insulator type | Nadia Ben Mohammed, Carine Duret | 2020-09-15 |
| 10703627 | Methods of fabricating semiconductor structures including cavities filled with a sacrificial material | Mariam Sadaka | 2020-07-07 |
| 10163682 | Methods of forming semiconductor structures | Cédric Malaquin, Damien Parissi | 2018-12-25 |
| 9768057 | Method for transferring a layer from a single-crystal substrate | Nicolas Daval, Nadia Ben Mohamed, Francois Boedt, Carole David, Isabelle Guerin | 2017-09-19 |
| 8962492 | Method to thin a silicon-on-insulator substrate | Patrick Reynaud, Khalid Radouane | 2015-02-24 |
| 8389412 | Finishing method for a silicon on insulator substrate | Walter Schwarzenbach, Sebastien Kerdiles, Patrick Reynaud, Eric Neyret | 2013-03-05 |
| 7892861 | Method for fabricating a compound-material wafer | Willy Michel, Patrick Reynaud, Walter Schwarzenbach | 2011-02-22 |
| 7883628 | Method of reducing the surface roughness of a semiconductor wafer | Eric Neyret, Emmanuel Arene | 2011-02-08 |
| 7749910 | Method of reducing the surface roughness of a semiconductor wafer | Eric Neyret, Christophe Maleville | 2010-07-06 |
| 7138344 | Method for minimizing slip line faults on a semiconductor wafer surface | Eric Neyret, Christophe Maleville | 2006-11-21 |
| 6962858 | Method for reducing free surface roughness of a semiconductor wafer | Eric Neyret | 2005-11-08 |