Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11822309 | System for inserting a wire into a semiconductor chip | Robin Lethiecq, Pavina Nguyen, Christopher Mackanic | 2023-11-21 |
| 11502411 | Radiofrequency transmission/reception device | Gianfranco Andia Vera | 2022-11-15 |
| 11209799 | Method for inserting a wire into a groove of a semiconductor chip | Robin Lethiecq, Pavina Nguyen, Christopher Mackanic | 2021-12-28 |
| 11081466 | Method for joining a micorelectronic chip to a wire element | Delphine Rolland, Christopher Mackanic, Gianfranco Andia Vera | 2021-08-03 |
| 8173512 | Forming structures that include a relaxed or pseudo-relaxed layer on a substrate | Bruno Ghyselen, Carlos Mazure | 2012-05-08 |
| 7919393 | Forming structures that include a relaxed or pseudo-relaxed layer on a substrate | Bruno Ghyselen, Carlos Mazure | 2011-04-05 |
| 7883628 | Method of reducing the surface roughness of a semiconductor wafer | Eric Neyret, Ludovic Ecarnot | 2011-02-08 |
| 7736988 | Forming structures that include a relaxed or pseudo-relaxed layer on a substrate | Bruno Ghyselen, Carlos Mazure | 2010-06-15 |
| 7138325 | Method of manufacturing a wafer | Christophe Maleville | 2006-11-21 |
| 7018909 | Forming structures that include a relaxed or pseudo-relaxed layer on a substrate | Bruno Ghyselen, Carlos Mazure | 2006-03-28 |