Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8679944 | Progressive trimming method | Marcel Broekaart, Marion Migette, Sebastien Molinari | 2014-03-25 |
| 8461018 | Treatment for bonding interface stabilization | Sebastien Kerdiles | 2013-06-11 |
| 8389412 | Finishing method for a silicon on insulator substrate | Walter Schwarzenbach, Sebastien Kerdiles, Patrick Reynaud, Ludovic Ecarnot | 2013-03-05 |
| 8273636 | Process for the transfer of a thin layer formed in a substrate with vacancy clusters | Oleg Kononchuk | 2012-09-25 |
| 8216916 | Treatment for bonding interface stabilization | Sebastien Kerdiles | 2012-07-10 |
| 7947571 | Method for fabricating a semiconductor on insulator substrate with reduced Secco defect density | Luciana Capello, Oleg Kononchuk, Alexandra Abbadie, Walter Schwarzenbach | 2011-05-24 |
| 7939427 | Process for fabricating a substrate of the silicon-on-insulator type with reduced roughness and uniform thickness | Francois Boedt | 2011-05-10 |
| 7883628 | Method of reducing the surface roughness of a semiconductor wafer | Ludovic Ecarnot, Emmanuel Arene | 2011-02-08 |
| 7863158 | Treatment for bonding interface stabilization | Sebastien Kerdiles | 2011-01-04 |
| 7749910 | Method of reducing the surface roughness of a semiconductor wafer | Ludovic Ecarnot, Christophe Maleville | 2010-07-06 |
| 7666758 | Process for fabricating a substrate of the silicon-on-insulator type with thin surface layer | — | 2010-02-23 |
| 7514341 | Finishing process for the manufacture of a semiconductor structure | Alice Boussagol, Nadia Ben Mohamed | 2009-04-07 |
| 7485545 | Method of configuring a process to obtain a thin layer with a low density of holes | Nadia Ben Mohamed, Daniel Delprat | 2009-02-03 |
| 7405136 | Methods for manufacturing compound-material wafers and for recycling used donor substrates | Daniel Delprat, Oleg Kononchuk, Patrick Reynaud, Michael Stinco | 2008-07-29 |
| 7285471 | Process for transfer of a thin layer formed in a substrate with vacancy clusters | Christophe Maleville | 2007-10-23 |
| 7190029 | Preventive treatment method for a multilayer semiconductor wafer | Christophe Maleville | 2007-03-13 |
| 7138344 | Method for minimizing slip line faults on a semiconductor wafer surface | Christophe Maleville, Ludovic Ecarnot | 2006-11-21 |
| 7081399 | Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations | Christophe Maleville, Nadia Ben Mohamed | 2006-07-25 |
| 7049250 | Heat treatment for edges of multilayer semiconductor wafers | Christophe Maleville | 2006-05-23 |
| 7001832 | Method for limiting slip lines in a semiconductor substrate | — | 2006-02-21 |
| 6962858 | Method for reducing free surface roughness of a semiconductor wafer | Ludovic Ecarnot | 2005-11-08 |
| 6939783 | Preventive treatment method for a multilayer semiconductor wafer | Christophe Maleville | 2005-09-06 |
| 6903032 | Method for preparing a semiconductor wafer surface | Christophe Maleville | 2005-06-07 |
| 6853802 | Heat treatment for edges of multilayer semiconductor wafers | Christophe Maleville | 2005-02-08 |