Daniel Delprat — 24 Patents at Soitec

Daniel Delprat has been granted 24 US patents while listed as an inventor at Soitec. The first was granted in 2002 and the most recent in July 2025. Daniel Delprat ranks #168,038 of 4,157,543 US inventors in our database (top 4.0%). Patent records list Daniel Delprat in Crolles, FR.

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12362226	Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate	Young-Pil Kim, Luciana Capello, Isabelle Bertrand, Frédéric Allibert	2025-07-15
12101080	Heterostructure and method of fabrication	Arnaud Castex, Bernard Aspar, Ionut Radu	2024-09-24
11637542	Heterostructure and method of fabrication	Arnaud Castex, Bernard Aspar, Ionut Radu	2023-04-25
11595020	Heterostructure and method of fabrication	Arnaud Castex, Bernard Aspar, Ionut Radu	2023-02-28
11373898	Method for manufacturing a semiconductor on insulator type structure by layer transfer	Damien Parissi, Marcel Broekaart	2022-06-28
11205702	Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit	Christophe Figuet, Ludovic Ecarnot, Bich-Yen Nguyen, Walter Schwarzenbach, Ionut Radu	2021-12-21
10826459	Heterostructure and method of fabrication	Arnaud Castex, Bernard Aspar, Ionut Radu	2020-11-03
9716029	Method for transferring a layer of a semiconductor and substrate comprising a confinement structure	Fabrice Lallement, Christophe Figuet	2017-07-25
9293473	Method for manufacturing a semiconductor on insulator structure having low electrical losses	Patrick Reynaud, Sebastien Kerdiles	2016-03-22
8962450	Method for manufacturing a semiconductor-on-insulator structure having low electrical losses	Patrick Reynaud, Sebastien Kerdiles	2015-02-24
8946053	Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate	Carine Duret, Nadia Ben-Mohamed, Fabrice Lallement	2015-02-03
8790993	Method for molecular bonding of silicon and glass substrates	Sebastien Kerdiles	2014-07-29
8772875	Semiconductor on glass substrate with stiffening layer	Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alexander Usenko	2014-07-08	$20,442,000
8658514	Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure	Patrick Reynaud, Sebastien Kerdiles	2014-02-25
8580654	Method for molecular bonding of silicon and glass substrates	Sebastien Kerdiles	2013-11-12
8518799	Process of making semiconductor on glass substrates with a stiffening layer	Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alex Usenko	2013-08-27	$16,299,000
8357974	Semiconductor on glass substrate with stiffening layer and process of making the same	Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alex Usenko	2013-01-22	$26,554,000
8349703	Method of bonding two substrates	Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach, Nadia Ben Mohamed	2013-01-08
7919391	Methods for preparing a bonding surface of a semiconductor wafer	Cecile Delattre, Frederic Metral, Christophe Maleville	2011-04-05
7645682	Bonding interface quality by cold cleaning and hot bonding	Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach	2010-01-12
7485545	Method of configuring a process to obtain a thin layer with a low density of holes	Nadia Ben Mohamed, Eric Neyret	2009-02-03
7405136	Methods for manufacturing compound-material wafers and for recycling used donor substrates	Eric Neyret, Oleg Kononchuk, Patrick Reynaud, Michael Stinco	2008-07-29
6563631	Tunable gain-clamped semiconductor optical amplifier	Guilhem Alibert	2003-05-13	$17,208,000
6459158	Vertically-tolerant alignment using slanted wall pedestal	Manuel Fendler, Anatolie Lupu	2002-10-01	$9,494,000

Daniel Delprat — 24 Patents

Issued Patents All Time

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