Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362226 | Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate | Young-Pil Kim, Luciana Capello, Isabelle Bertrand, Frédéric Allibert | 2025-07-15 |
| 12101080 | Heterostructure and method of fabrication | Arnaud Castex, Bernard Aspar, Ionut Radu | 2024-09-24 |
| 11637542 | Heterostructure and method of fabrication | Arnaud Castex, Bernard Aspar, Ionut Radu | 2023-04-25 |
| 11595020 | Heterostructure and method of fabrication | Arnaud Castex, Bernard Aspar, Ionut Radu | 2023-02-28 |
| 11373898 | Method for manufacturing a semiconductor on insulator type structure by layer transfer | Damien Parissi, Marcel Broekaart | 2022-06-28 |
| 11205702 | Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit | Christophe Figuet, Ludovic Ecarnot, Bich-Yen Nguyen, Walter Schwarzenbach, Ionut Radu | 2021-12-21 |
| 10826459 | Heterostructure and method of fabrication | Arnaud Castex, Bernard Aspar, Ionut Radu | 2020-11-03 |
| 9716029 | Method for transferring a layer of a semiconductor and substrate comprising a confinement structure | Fabrice Lallement, Christophe Figuet | 2017-07-25 |
| 9293473 | Method for manufacturing a semiconductor on insulator structure having low electrical losses | Patrick Reynaud, Sebastien Kerdiles | 2016-03-22 |
| 8962450 | Method for manufacturing a semiconductor-on-insulator structure having low electrical losses | Patrick Reynaud, Sebastien Kerdiles | 2015-02-24 |
| 8946053 | Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate | Carine Duret, Nadia Ben-Mohamed, Fabrice Lallement | 2015-02-03 |
| 8790993 | Method for molecular bonding of silicon and glass substrates | Sebastien Kerdiles | 2014-07-29 |
| 8772875 | Semiconductor on glass substrate with stiffening layer | Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alexander Usenko | 2014-07-08 |
| 8658514 | Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure | Patrick Reynaud, Sebastien Kerdiles | 2014-02-25 |
| 8580654 | Method for molecular bonding of silicon and glass substrates | Sebastien Kerdiles | 2013-11-12 |
| 8518799 | Process of making semiconductor on glass substrates with a stiffening layer | Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alex Usenko | 2013-08-27 |
| 8357974 | Semiconductor on glass substrate with stiffening layer and process of making the same | Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alex Usenko | 2013-01-22 |
| 8349703 | Method of bonding two substrates | Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach, Nadia Ben Mohamed | 2013-01-08 |
| 7919391 | Methods for preparing a bonding surface of a semiconductor wafer | Cecile Delattre, Frederic Metral, Christophe Maleville | 2011-04-05 |
| 7645682 | Bonding interface quality by cold cleaning and hot bonding | Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach | 2010-01-12 |
| 7485545 | Method of configuring a process to obtain a thin layer with a low density of holes | Nadia Ben Mohamed, Eric Neyret | 2009-02-03 |
| 7405136 | Methods for manufacturing compound-material wafers and for recycling used donor substrates | Eric Neyret, Oleg Kononchuk, Patrick Reynaud, Michael Stinco | 2008-07-29 |
| 6563631 | Tunable gain-clamped semiconductor optical amplifier | Guilhem Alibert | 2003-05-13 |
| 6459158 | Vertically-tolerant alignment using slanted wall pedestal | Manuel Fendler, Anatolie Lupu | 2002-10-01 |