Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8158013 | Process for bonding by molecular adhesion | Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz | 2012-04-17 |
| 8091601 | Equipment for bonding by molecular adhesion | Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz | 2012-01-10 |
| 7919391 | Methods for preparing a bonding surface of a semiconductor wafer | Cecile Delattre, Daniel Delprat, Christophe Maleville | 2011-04-05 |
| 7718534 | Planarization of a heteroepitaxial layer | Muriel Martinez, Patrick Reynaud, Zohra Chahra | 2010-05-18 |
| 7601271 | Process and equipment for bonding by molecular adhesion | Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz | 2009-10-13 |
| 7022586 | Method for recycling a substrate | Christophe Maleville, Fabrice Letertre, Thibaut Maurice, Carlos Mazure | 2006-04-04 |
| 6988936 | Surface preparation for receiving processing treatments | Laurent Filipozzi | 2006-01-24 |
| 6881596 | Method for automatically determining the surface quality of a bonding interface between two wafers | Christophe Malville | 2005-04-19 |