Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114314 | Method for fabrication of a semiconductor structure including an interposer free from any through via | Bich-Yen Nguyen, Ludovic Ecarnot, Nadia Ben Mohamed | 2021-09-07 |
| 6881596 | Method for automatically determining the surface quality of a bonding interface between two wafers | Frederic Metral | 2005-04-19 |