Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272720 | Front-side type image sensors | — | 2025-04-08 |
| 12261079 | Method for fabricating a strained semiconductor-on-insulator substrate | Guillaume Chabanne, Nicolas Daval | 2025-03-25 |
| 12218201 | Device architectures with tensile and compressive strained substrates | Bich-Yen Nguyen, Christophe Maleville, Gong Xiao, Aaron Voon-Yew THEAN, Chen Sun +1 more | 2025-02-04 |
| 12198975 | Semiconductor on insulator structure for a front side type imager | Oleg Kononchuk, Ludovic Ecarnot | 2025-01-14 |
| 12176244 | Method for bonding two substrates | Laurent Viravaux | 2024-12-24 |
| 12148755 | Front-side-type image sensor | Manuel Sellier, Ludovic Ecarnot | 2024-11-19 |
| 12100727 | Method for manufacturing a substrate for a front-facing image sensor | Ludovic Ecarnot, Damien Massy, Nadia Ben Mohamed, Nicolas Daval, Christophe Girard +1 more | 2024-09-24 |
| 12074056 | Method for producing an advanced substrate for hybrid integration | — | 2024-08-27 |
| 11876020 | Method for manufacturing a CFET device | Ludovic Ecarnot, Nicolas Daval, Bich-Yen Nguyen, Guillaume Besnard | 2024-01-16 |
| 11855120 | Substrate for a front-side-type image sensor and method for producing such a substrate | Oleg Kononchuk, Ludovic Ecarnot, Christelle Michau | 2023-12-26 |
| 11728207 | Method for fabricating a strained semiconductor-on-insulator substrate | Guillaume Chabanne, Nicolas Daval | 2023-08-15 |
| 11552123 | Front-side type image sensors | — | 2023-01-10 |
| 11476153 | Method for producing an advanced substrate for hybrid integration | — | 2022-10-18 |
| 11282889 | Substrate for a front-side-type image sensor and method for producing such a substrate | Oleg Kononchuk, Ludovic Ecarnot, Christelle Michau | 2022-03-22 |
| 11205702 | Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit | Christophe Figuet, Ludovic Ecarnot, Bich-Yen Nguyen, Daniel Delprat, Ionut Radu | 2021-12-21 |
| 11127775 | Substrate for front side type imager and method of manufacturing such a substrate | Oleg Kononchuk, Ludovic Ecarnot, Christelle Michau | 2021-09-21 |
| 11127624 | Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager | Oleg Kononchuk, Ludovic Ecarnot | 2021-09-21 |
| 10957577 | Method for fabricating a strained semiconductor-on-insulator substrate | Guillaume Chabanne, Nicolas Daval | 2021-03-23 |
| 10903263 | Front-side type image sensor and method for manufacturing such a sensor | — | 2021-01-26 |
| 10672646 | Method for fabricating a strained semiconductor-on-insulator substrate | Guillaume Chabanne, Nicolas Daval | 2020-06-02 |
| 9698063 | Method of testing a semiconductor-on-insulator structure and application of said test to the fabrication of such a structure | Patrick Reynaud, Konstantin Bourdelle, Jean Gilbert | 2017-07-04 |
| 9576798 | Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers | Bich-Yen Nguyen, Christophe Maleville | 2017-02-21 |
| 9209301 | Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers | Bich-Yen Nguyen, Christophe Maleville | 2015-12-08 |
| 9190284 | Process for treating a semiconductor-on-insulator structure for improving thickness uniformity of the semiconductor layer | Carine Duret, Francois Boedt | 2015-11-17 |
| 8728913 | Method for transferring a layer from a donor substrate onto a handle substrate | Sebastien Kerdiles, Aziz Alami-Idrissi | 2014-05-20 |