Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit

Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit

US Patent 11205702 · Granted Dec 21, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure for digital and radiofrequency applications, and method 2025
Semiconductor structure for digital and radiofrequency applications, and method 2025
Process for hydrophilically bonding substrates2025
Method for forming a handling substrate for a composite structure intended for R2025
Methods of fabricating semiconductor structures including cavities filled with a2025
Method for manufacturing a composite structure comprising a thin layer made of m2025
Surface acoustic wave device including transducer in dielectric between a piezoe2025
Front-side type image sensors2025
Method for fabricating a strained semiconductor-on-insulator substrate2025
Device architectures with tensile and compressive strained substrates2025
Device architectures with tensile and compressive strained substrates2025
Semiconductor on insulator structure for a front side type imager2025