Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8617962 | Method for finishing a substrate of the semiconductor-on-insulator type | Aziz Alami-Idrissi, Alexandre Chibko, Sebastien Kerdiles | 2013-12-31 |
| 8476148 | Method for transferring a layer from a donor substrate onto a handle substrate | Sebastien Kerdiles, Aziz Alami-Idrissi | 2013-07-02 |
| 8435897 | Method for reclaiming a surface of a substrate | Aziz Alami-Idrissi, Sebastien Kerdiles | 2013-05-07 |
| 8420500 | Method of producing a structure by layer transfer | Brigitte Soulier-Bouchet, Sebastien Kerdiles | 2013-04-16 |
| 8389412 | Finishing method for a silicon on insulator substrate | Sebastien Kerdiles, Patrick Reynaud, Ludovic Ecarnot, Eric Neyret | 2013-03-05 |
| 8357587 | Method for routing a chamfered substrate | Aziz Alami-Idrissi, Alexandre Chibko, Sebastien Kerdiles | 2013-01-22 |
| 8349703 | Method of bonding two substrates | Sebastien Kerdiles, Willy Michel, Daniel Delprat, Nadia Ben Mohamed | 2013-01-08 |
| 8088671 | Defectivity of post thin layer separation by modification of its separation annealing | Nadia Ben Mohamed, Fleur Guittard | 2012-01-03 |
| 7947571 | Method for fabricating a semiconductor on insulator substrate with reduced Secco defect density | Luciana Capello, Oleg Kononchuk, Eric Neyret, Alexandra Abbadie | 2011-05-24 |
| 7892861 | Method for fabricating a compound-material wafer | Ludovic Ecarnot, Willy Michel, Patrick Reynaud | 2011-02-22 |
| 7871900 | Quality of a thin layer through high-temperature thermal annealing | Konstantin Bourdelle, Nguyet-Phuong Nguyen | 2011-01-18 |
| 7749862 | Methods for minimizing defects when transferring a semiconductor useful layer | Nadia Ben Mohamed, Christophe Maleville, Corinne Maunand Tussot | 2010-07-06 |
| 7648888 | Apparatus and method for splitting substrates | Thierry Barge, Jean-Marc Waechter, Thuan Truong, Bruno Ghyselen | 2010-01-19 |
| 7645682 | Bonding interface quality by cold cleaning and hot bonding | Sebastien Kerdiles, Willy Michel, Daniel Delprat | 2010-01-12 |
| 7585793 | Method for applying a high temperature heat treatment to a semiconductor wafer | Christophe Maleville, Vivien Renauld | 2009-09-08 |
| 7544058 | Method for high-temperature annealing a multilayer wafer | Christophe Maleville, Vivien Renauld | 2009-06-09 |
| 7466907 | Annealing process and device of semiconductor wafer | Jean-Marc Waechter | 2008-12-16 |
| 7465645 | Method of detaching a layer from a wafer using a localized starting area | Christophe Maleville, Nadia Ben Mohamed | 2008-12-16 |
| 7300856 | Process for detaching layers of material | Christophe Maleville | 2007-11-27 |
| 7098148 | Method for heat treating a semiconductor wafer | Jean-Marc Waechter | 2006-08-29 |
| 7094668 | Annealing process and device of semiconductor wafer | Jean-Marc Waechter | 2006-08-22 |
| 7017570 | Apparatus and method for splitting substrates | Thierry Barge, Jean-Marc Waechter, Thuan Truong, Bruno Ghyselen | 2006-03-28 |
| 6987051 | Method of making cavities in a semiconductor wafer | Christophe Maleville | 2006-01-17 |
| 6919107 | Method and device for treating surfaces using a glow discharge plasma | Bertrand Roessler, Pierre Fayet | 2005-07-19 |
| 6884697 | Process for cleaving a wafer layer from a donor wafer | Christophe Maleville | 2005-04-26 |