AU

Alexander Usenko

ST Silicon Wafer Technologies: 10 patents #1 of 3Top 35%
CI Corning Incorporated: 2 patents #1,705 of 3,867Top 45%
SO Soitec: 1 patents #140 of 259Top 55%
CM Curators Of The University Of Missouri: 1 patents #512 of 1,157Top 45%
Overall (All Time): #261,807 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12206030 Stacked diode with side passivation and method of making the same Steven Bellinger, Anthony Caruso 2025-01-21
12009252 Method of making a silicon on insulator wafer 2024-06-11
11456204 Silicon-on-insulator wafer and low temperature method to make thereof 2022-09-27
10921491 Method of making a surface with improved mechanical and optical properties 2021-02-16
8796054 Gallium nitride to silicon direct wafer bonding 2014-08-05
8772875 Semiconductor on glass substrate with stiffening layer Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Daniel Delprat 2014-07-08
7148124 Method for forming a fragile layer inside of a single crystalline substrate preferably for making silicon-on-insulator wafers 2006-12-12
6995075 Process for forming a fragile layer inside of a single crystalline substrate 2006-02-07
6861320 Method of making starting material for chip fabrication comprising a buried silicon nitride layer 2005-03-01
6806171 Method of producing a thin layer of crystalline material Alexander Ulyashin 2004-10-19
6696352 Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer William N. Carr 2004-02-24
6387829 Separation process for silicon-on-insulator wafer fabrication William N. Carr 2002-05-14
6368938 Process for manufacturing a silicon-on-insulator substrate and semiconductor devices on said substrate 2002-04-09
6355493 Method for forming IC's comprising a highly-resistive or semi-insulating semiconductor substrate having a thin, low resistance active semiconductor layer thereon 2002-03-12
6352909 Process for lift-off of a layer from a substrate 2002-03-05
6346459 Process for lift off and transfer of semiconductor devices onto an alien substrate William N. Carr 2002-02-12
6344417 Method for micro-mechanical structures 2002-02-05