Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230533 | Method for manufacturing a semiconductor-on-insulator substrate | Marcel Broekaart | 2025-02-18 |
| 12101080 | Heterostructure and method of fabrication | Daniel Delprat, Bernard Aspar, Ionut Radu | 2024-09-24 |
| 11637542 | Heterostructure and method of fabrication | Daniel Delprat, Bernard Aspar, Ionut Radu | 2023-04-25 |
| 11626319 | Semiconductor-on-insulator substrate for rf applications | Oleg Kononchuk | 2023-04-11 |
| 11595020 | Heterostructure and method of fabrication | Daniel Delprat, Bernard Aspar, Ionut Radu | 2023-02-28 |
| 10886162 | Semiconductor-on-insulator substrate for RF applications | Oleg Kononchuk | 2021-01-05 |
| 10826459 | Heterostructure and method of fabrication | Daniel Delprat, Bernard Aspar, Ionut Radu | 2020-11-03 |
| 9905531 | Method for producing composite structure with metal/metal bonding | Ionut Radu, Marcel Broekaart, Gweltaz Gaudin, Gregory Riou | 2018-02-27 |
| 9733075 | System and method for assessing inhomogeneous deformations in multilayer plates | Marcel Broekaart, Laurent Marinier | 2017-08-15 |
| 9548202 | Method for bonding by means of molecular adhesion | Marcel Broekaart | 2017-01-17 |
| 9004135 | Method and apparatus for bonding together two wafers by molecular adhesion | Marcel Broekaart | 2015-04-14 |
| 8932938 | Method of fabricating a multilayer structure with circuit layer transfer | Marcel Broekaart | 2015-01-13 |
| 8927320 | Method of bonding by molecular bonding | Chrystelle Lagahe Blanchard, Marcel Broekaart | 2015-01-06 |
| 8575002 | Direct bonding method with reduction in overlay misalignment | Marcel Broekaart, Gweltaz Gaudin | 2013-11-05 |
| 8202785 | Surface treatment for molecular bonding | Gweltaz Gaudin, Marcel Broekaart | 2012-06-19 |
| 8163570 | Method of initiating molecular bonding | Marcel Broekaart | 2012-04-24 |