Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424497 | Method for transferring a layer from a source substrate to a destination substrate | Julie Widiez | 2025-09-23 |
| 12417942 | Process for hydrophilically bonding substrates | Vincent Larrey, Francois Rieutord, Jean-Michel Hartmann, Didier Landru, Oleg Kononchuk +1 more | 2025-09-16 |
| 12412786 | Method for transferring a layer from a source substrate to a destination substrate | Julie Widiez | 2025-09-09 |
| 12322717 | Semiconductor device and method for manufacturing a semiconductor device | Jens Hofrichter, Manuel Kaschowitz, Bernhard Poelzl, Karl Rohracher, Amandine Jouve +3 more | 2025-06-03 |
| 12227679 | Surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate | Karine ABADIE, Quentin Lomonaco | 2025-02-18 |
| 11715710 | Method of treatment of an electronic circuit for a hybrid molecular bonding | Emilie Bourjot, Amandine Jouve, Christophe Dubarry | 2023-08-01 |
| 11710653 | Method for manufacturing a handle substrate intended for temporary bonding of a substrate | Pierre Montmeat, Paul Alan Stewart | 2023-07-25 |
| 11694991 | Method for transferring chips | Emilie Bourjot, Severine Cheramy, Sylvain Maitrejean, Loic Sanchez | 2023-07-04 |
| 11575063 | Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter material | Sébastien Becker | 2023-02-07 |
| 11569115 | Temporary bonding method | Pierre Montmeat, Laurent Bally, Thierry Enot | 2023-01-31 |
| 11562899 | Method for transferring thin layers | Pierre Montmeat | 2023-01-24 |
| 11551976 | Thin-film transfer method | Laurent Michaud, Pierre Montmeat | 2023-01-10 |
| 11482567 | LED emissive display device and method for producing such a device | François Templier, Severine Cheramy | 2022-10-25 |
| 11346722 | Method for fabricating a detection device comprising a step of transferring and direct bonding of a thin layer provided with a getter material | Sébastien Becker | 2022-05-31 |
| 11335584 | Method of dismantling a stack of at least three substrates | Pierre Montmeat, Thierry Enot | 2022-05-17 |
| 11244971 | Method of transferring a thin film from a substrate to a flexible support | Laurent Michaud, Clement Castan, Pierre Montmeat | 2022-02-08 |
| 11088010 | Temporary bonding method with thermoplastic adhesive incorporating a rigid ring | Pierre Montmeat, Marc Zussy | 2021-08-10 |
| 11081463 | Bonding method with electron-stimulated desorption | Vincent Larrey, Sylvain Maitrejean, Christophe Morales | 2021-08-03 |
| 11056340 | Direct bonding process | Frédéric Mazen | 2021-07-06 |
| 11054402 | Method and device for checking a bond between two substrates | Ali Dekious, Emilie DELOFFRE, Gilles Despaux, Vincent Larrey, Emmanuel Le Clezio | 2021-07-06 |
| 10957539 | Method for bonding by direct adhesion | Vincent Larrey, Christophe Morales, Marwan Tedjini | 2021-03-23 |
| 10884187 | Method for the collective production of a plurality of optoelectronic chips | Sylvie Menezo | 2021-01-05 |
| 10854493 | Method for manufacturing a handling device and method for reversible bonding using such a device | Pierre Montmeat | 2020-12-01 |
| 10643884 | Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer | Elodie Beche, Vincent Larrey | 2020-05-05 |
| 10497609 | Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates | Christophe Morales, Hubert Moriceau, Francois Rieutord | 2019-12-03 |