JW

Julie Widiez

CEA: 12 patents #278 of 7,956Top 4%
CN CNRS: 4 patents #613 of 11,908Top 6%
IG Institut Polytechnique De Grenoble: 1 patents #62 of 266Top 25%
SO Soitec: 1 patents #140 of 259Top 55%
Overall (All Time): #400,100 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12424497 Method for transferring a layer from a source substrate to a destination substrate Frank Fournel 2025-09-23
12412786 Method for transferring a layer from a source substrate to a destination substrate Frank Fournel 2025-09-09
12166063 Optoelectronic device having an array of germanium-based diodes with low dark current Jean-Louis Ouvrier-Buffet, Abdelkader Aliane, Jean-Michel Hartmann 2024-12-10
11887910 Electronic power module Kremena Vladimirova, Jean-Christophe Crebier 2024-01-30
11264425 Process for fabricating an array of germanium-based diodes with low dark current Jean-Louis Ouvrier-Buffet, Abdelkader Aliane, Jean-Michel Hartmann 2022-03-01
11251339 Process for fabricating an optoelectronic device for emitting infrared light comprising a GeSn-based active layer Vincent Reboud, Alexei Tchelnokov 2022-02-15
11005002 Manufacturing of a semiconductor photosensitive device Willy Ludurczak, Abdelkader Aliane, Luc Andre, Jean-Louis Ouvrier-Buffet 2021-05-11
10840110 Process for fabricating a heterostructure comprising a conductive structure and a semiconductor structure and including a step of electrical discharge machining Bastien Letowski 2020-11-17
10083942 Electronic power device with vertical 3D switching cell Bastien Letowski, Jean-Christophe Crebier, Nicolas Rouger 2018-09-25
9991191 Electronic power device with flat electronic interconnection structure Bastien Letowski, Jean-Christophe Crebier, Nicolas Rouger 2018-06-05
9129800 Manufacturing method for a semiconductor on insulator type substrate for radiofrequency applications Frédéric Allibert 2015-09-08
8766433 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip Yvan Avenas, Jean-Christophe Crebier, Laurent Clavelier, Kremena Vladimirova 2014-07-01