Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643884 | Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer | Frank Fournel, Vincent Larrey | 2020-05-05 |
| 9718261 | Assembly process of two substrates | Didier Landru, Capucine Delage, Franck Fournel | 2017-08-01 |