Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127775 | Substrate for front side type imager and method of manufacturing such a substrate | Walter Schwarzenbach, Ludovic Ecarnot, Christelle Michau | 2021-09-21 |
| 10950491 | Method for transferring a useful layer | Didier Landru, Nadia Ben Mohamed, Frédéric Mazen, Damien Massy, Shay Reboh +1 more | 2021-03-16 |
| 10943815 | Structure for radiofrequency applications | Eric Desbonnets, Ionut Radu, Jean-Pierre Raskin | 2021-03-09 |
| 10924081 | Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device | Marcel Broekaart, Thierry Barge, Pascal Guenard, Ionut Radu, Eric Desbonnets | 2021-02-16 |
| 10910256 | Pseudo-substrate with improved efficiency of usage of single crystal material | Fabrice Letertre | 2021-02-02 |
| 10886162 | Semiconductor-on-insulator substrate for RF applications | Arnaud Castex | 2021-01-05 |
| 10619997 | Method for measuring thickness variations in a layer of a multilayer semiconductor structure | — | 2020-04-14 |
| 10608610 | Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device | Marcel Broekaart, Thierry Barge, Pascal Guenard, Ionut Radu, Eric Desbonnets | 2020-03-31 |
| 10510531 | Method of fabrication of a semiconductor element comprising a highly resistive substrate | Isabelle Bertrand, Luciana Capello, Marcel Broekaart | 2019-12-17 |
| 10510565 | Thermal treatment system with collector device | Didier Landru, Sébastien Simon | 2019-12-17 |
| 10347597 | Structure for radio-frequency applications | William Van Den Daele, Eric Desbonnets | 2019-07-09 |
| 10250282 | Structure for radiofrequency applications | Didier Landru, Christophe Figuet | 2019-04-02 |
| 10134602 | Process for smoothing the surface of a structure | Didier Landru, Carole David | 2018-11-20 |
| 9922867 | Method for transferring a useful layer | Didier Landru, Nadia Ben Mohamed | 2018-03-20 |
| 9911624 | Method for dissolving a silicon dioxide layer | Didier Landru | 2018-03-06 |
| 9911616 | Process for treating a structure | — | 2018-03-06 |
| 9875914 | Process for manufacturing a plurality of structures | Didier Landru, Christophe Gourdel, Carole David, Sebastien Mougel, Xavier Schneider | 2018-01-23 |
| 9759546 | Method for measuring thickness variations in a layer of a multilayer semiconductor structure | Didier Dutartre | 2017-09-12 |
| 9679777 | Process, stack and assembly for separating a structure from a substrate by electromagnetic radiation | Yann Sinquin, Jean-Marc Bethoux | 2017-06-13 |
| 9679799 | Process for fabricating a semiconductor-on-insulator substrate | Christophe Gourdel | 2017-06-13 |
| 9589830 | Method for transferring a useful layer | Didier Landru, Nadia Ben Mohamed, Damien Massy, Frédéric Mazen, Francois Rieutord | 2017-03-07 |
| 9548237 | Method for transferring a layer comprising a compressive stress layer and related structures | Gweltaz Gaudin, Ionut Radu | 2017-01-17 |
| 9514960 | Method for dissolving a silicon dioxide layer | Didier Landru | 2016-12-06 |
| 9396987 | Method for fabricating a substrate and semiconductor structure | — | 2016-07-19 |
| 9198294 | Electronic device for radiofrequency or power applications and process for manufacturing such a device | Didier Landru, Luciana Capello, Eric Desbonnet, Christophe Figuet | 2015-11-24 |