Issued Patents All Time
Showing 76–83 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6416391 | Method of demounting silicon wafers after polishing | Zbigniew J. Radzimski | 2002-07-09 |
| 6352071 | Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw | George Preece | 2002-03-05 |
| 6346460 | Low cost silicon substrate with impurity gettering and latch up protection and method of manufacture | Sergei Koveshnikov | 2002-02-12 |
| 6286685 | System and method for wafer thickness sorting | Stephen Martin | 2001-09-11 |
| 6284986 | Method of determining the thickness of a layer on a silicon substrate | Gerald R. Dietze | 2001-09-04 |
| 6190453 | Growth of epitaxial semiconductor material with improved crystallographic properties | Mark R. Boydston, Gerald R. Dietze | 2001-02-20 |
| 6184154 | Method of processing the backside of a wafer within an epitaxial reactor chamber | Gerald R. Dietze | 2001-02-06 |
| 6059875 | Method of effecting nitrogen doping in Czochralski grown silicon crystal | Scott Matthew Kirkland, Akihiko Tamura | 2000-05-09 |