Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002763 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Bruno Ghyselen | 2018-06-19 |
| 8991673 | Substrate cutting device and method | Fabrice Letertre | 2015-03-31 |
| 8507361 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Bruno Ghyselen | 2013-08-13 |
| 8252664 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Bruno Ghyselen | 2012-08-28 |
| 8093687 | Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer | Fabrice Letertre | 2012-01-10 |
| 8083115 | Substrate cutting device and method | Fabrice Letertre | 2011-12-27 |
| 8012289 | Method of fabricating a release substrate | Takeshi Akatsu | 2011-09-06 |
| 7972939 | Transfer method with a treatment of a surface to be bonded | Sebastien Kerdiles, Christophe Maleville, Fabrice Letertre | 2011-07-05 |
| 7939428 | Methods for making substrates and substrates formed therefrom | Alice Boussagol, Bruce Faure, Bruno Ghyselen, Fabrice Letertre | 2011-05-10 |
| 7902038 | Detachable substrate with controlled mechanical strength and method of producing same | Bernard Aspar, Hubert Moriceau, Bruno Ghyselen | 2011-03-08 |
| 7892946 | Device and method for cutting an assembly | Fabrice Letertre | 2011-02-22 |
| 7888235 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Bruno Ghyselen | 2011-02-15 |
| 7839001 | Methods for making substrates and substrates formed therefrom | Alice Boussagol, Bruce Faure, Bruno Ghyselen, Fabrice Letertre | 2010-11-23 |
| 7713369 | Detachable substrate or detachable structure and method for the production thereof | Bernard Aspar, Hubert Moriceau, Marc Zussy | 2010-05-11 |
| 7670929 | Method for direct bonding two semiconductor substrates | Konstantin Bourdelle, Carlos Mazure | 2010-03-02 |
| 7615464 | Transfer method with a treatment of a surface to be bonded | Sebastien Kerdiles, Christophe Maleville, Fabrice Letertre | 2009-11-10 |
| 7615468 | Methods for making substrates and substrates formed therefrom | Alice Boussagol, Bruce Faure, Bruno Ghyselen, Fabrice Letertre | 2009-11-10 |
| 7575988 | Method of fabricating a hybrid substrate | Konstantin Bourdelle, Carlos Mazure | 2009-08-18 |
| 7544586 | Method of fabricating chips and an associated support | Bruno Ghyselen | 2009-06-09 |
| 7544265 | Method of fabricating a release substrate | Takeshi Akatsu | 2009-06-09 |
| 7498245 | Embrittled substrate and method for making same | Bernard Aspar, Chrystelle Lagahe, Bruno Ghyselen | 2009-03-03 |
| 7449394 | Atomic implantation and thermal treatment of a semiconductor layer | Takeshi Akatsu, Nicolas Daval, Nguyet-Phuong Nguyen, Konstantin Bourdelle | 2008-11-11 |
| 7439160 | Methods for producing a semiconductor entity | Yves-Matthieu Le Vaillant, Christophe Fernandez | 2008-10-21 |
| 7406994 | Substrate layer cutting device and method | Muriel Martinez, Thierry Barge, Alain Soubie, Chrystelle Lagahe-Blanchard, Cecile Berne | 2008-08-05 |
| 7405135 | Substrate for stressed systems and method of making same | Fabrice Letertre, Bruno Ghyselen | 2008-07-29 |