Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8722515 | Process of treating defects during the bonding of wafers | Bernard Aspar | 2014-05-13 |
| 8530334 | Process of treating defects during the bonding of wafers | Bernard Aspar | 2013-09-10 |
| 7776714 | Method for production of a very thin layer with thinning by means of induced self-support | Hubert Moriceau, Benoit Bataillou | 2010-08-17 |
| 7498245 | Embrittled substrate and method for making same | Bernard Aspar, Olivier Rayssac, Bruno Ghyselen | 2009-03-03 |
| 7238598 | Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element | Bernard Aspar, Aurélie Beaumont | 2007-07-03 |
| 6936523 | Two-stage annealing method for manufacturing semiconductor substrates | Cecile Berne, Bruno Ghyselen, Thibaut Maurice | 2005-08-30 |
| 6465327 | Method for producing a thin membrane and resulting structure with membrane | Bernard Aspar, Michel Bruel, Claude Jaussaud | 2002-10-15 |