Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7404870 | Methods for forming an assembly for transfer of a useful layer | Fabrice Letertre | 2008-07-29 |
| 7391094 | Semiconductor structure and method of making same | Muriel Martinez, Sephorah Bisson, Lionel Portigliatti | 2008-06-24 |
| 7279779 | Substrate assembly for stressed systems | Fabrice Letertre, Bruno Ghyselen | 2007-10-09 |
| 7276428 | Methods for forming a semiconductor structure | Nicolas Daval, Takeshi Akatsu, Nguyet-Phuong Nguyen | 2007-10-02 |
| 7265029 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Bruno Ghyselen | 2007-09-04 |
| 7256101 | Methods for preparing a semiconductor assembly | Fabrice Letertre, Bruno Ghyselen | 2007-08-14 |
| 7235461 | Method for bonding semiconductor structures together | Christophe Maleville, Corinne Maunand Tussot, Sebastien Kerdiles, Benjamin Scarfogliere, Hubert Moriceau +1 more | 2007-06-26 |
| 7232738 | Device and method for cutting an assembly | Fabrice Letertre | 2007-06-19 |
| 7189304 | Substrate layer cutting device and method | Muriel Martinez, Thierry Barge, Alain Soubie, Chrystelle Lagahe-Blanchard, Cecile Berne | 2007-03-13 |
| 7182234 | Substrate cutting device and method | Fabrice Letertre | 2007-02-27 |
| 7176554 | Methods for producing a semiconductor entity | Yves-Matthieu Le Vaillant, Christophe Fernandez | 2007-02-13 |
| 7169683 | Preventive treatment method for a multilayer semiconductor structure | Bruno Ghyselen | 2007-01-30 |
| 7163873 | Substrate for stressed systems and method of making same | Fabrice Letertre, Bruno Ghyselen | 2007-01-16 |
| 7145214 | Substrate for stressed systems and method of making same | Fabrice Letertre, Bruno Ghyselen | 2006-12-05 |
| 7122095 | Methods for forming an assembly for transfer of a useful layer | Fabrice Letertre | 2006-10-17 |
| 7067393 | Substrate assembly for stressed systems | Fabrice Letertre, Bruno Ghyselen | 2006-06-27 |
| 7060590 | Layer transfer method | Severine Bressot, Bernard Aspar | 2006-06-13 |
| 7056809 | Method for ion treating a semiconductor material for subsequent bonding | — | 2006-06-06 |
| 7041577 | Process for manufacturing a substrate and associated substrate | Fabrice Letertre | 2006-05-09 |
| 6991944 | Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials | Beryl Blondeau, Hubert Moriceau, Christelle Lagahe-Blanchard, Franck Fournel | 2006-01-31 |
| 6989314 | Semiconductor structure and method of making same | Muriel Martinez, Sephorah Bisson, Lionel Portigliatti | 2006-01-24 |
| 6913971 | Layer transfer methods | Bernard Aspar, Severine Bressot | 2005-07-05 |
| 6821376 | Method for separating two elements and a device therefor | Hubert Moriceau, Bernard Aspar, Philippe Montmayeul | 2004-11-23 |
| 6756285 | Multilayer structure with controlled internal stresses and making same | Hubert Moriceau, Anne-Marie Cartier, Bernard Aspar | 2004-06-29 |
| 6204079 | Selective transfer of elements from one support to another support | Bernard Aspar, Hubert Moriceau | 2001-03-20 |