Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865545 | Plurality of substrates bonded by direct bonding of copper recesses | Viorel Balan | 2018-01-09 |
| 9620385 | Method of planarizing recesses filled with copper | Viorel Balan | 2017-04-11 |
| 9620412 | Method for modifying the crystalline structure of a copper element | Lea Di Cioccio, Pierric Gueguen | 2017-04-11 |
| 8647983 | Simplified copper-copper bonding | Lea Di Cioccio, Pierric Gueguen | 2014-02-11 |
| 8562934 | Method for forming porous material in microcavity or micropassage by mechanicochemical polishing | Jean-Christophe Coiffic | 2013-10-22 |
| 8323733 | Method for producing a membrane comprising micropassages made from porous material by chemical mechanical polishing | Jean-Christophe Coiffic | 2012-12-04 |
| 7713766 | Light sensor located above an integrated circuit | Danielle A. Thomas | 2010-05-11 |
| 7492026 | Light sensor located above an integrated circuit | Danielle A. Thomas | 2009-02-17 |
| 7252695 | Abrasive composition for the integrated circuit electronics industry | Eric Jacquinot, Pascal Letourneau | 2007-08-07 |
| 7200908 | Method of making a variable capacitor component | Fabrice Cassett, Guillaume Bouche | 2007-04-10 |
| 7144814 | Abrasive composition for the integrated circuits electronics industry | Eric Jacquinot, Pascal Letourneau | 2006-12-05 |
| 6429098 | Process for obtaining a layer of single-crystal germanium or silicon on a substrate of single-crystal silicon or germanium, respectively, and multilayer products obtained | Daniel Bensahel, Yves Campidelli, Caroline Hernandez | 2002-08-06 |
| 6399502 | Process for fabricating a planar heterostructure | Caroline Hernandez, Yves Campidelli, Daniel Bensahel | 2002-06-04 |
| 6386950 | Process for mechanical chemical polishing of layer of aluminium or aluminium alloy conducting material | Eric Jacquinot, Pascal Letourneau | 2002-05-14 |
| 6362108 | Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant | Eric Jacquinot, Pascal Letourneau | 2002-03-26 |
| 6302765 | Process for mechanical chemical polishing of a layer in a copper-based material | Eric Jacquinot, Pascal Letourneau | 2001-10-16 |
| 6126518 | Chemical mechanical polishing process for layers of semiconductor or isolating materials | Eric Jacquinot, Catherine Euvrard | 2000-10-03 |
| 6117750 | Process for obtaining a layer of single-crystal germanium or silicon on a substrate of single-crystal silicon or germanium, respectively | Daniel Bensahel, Yves Campidelli, Caroline Hernandez | 2000-09-12 |
| 6043159 | Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon | Eric Jacquinot | 2000-03-28 |
| 5431964 | Method of pretreating the deposition chamber and/or the substrate for the selective deposition of tungsten | — | 1995-07-11 |