Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218163 | Image acquisition device | Mickael Fourel | 2025-02-04 |
| 11948950 | Image acquisition device | Mickael Fourel | 2024-04-02 |
| 10403682 | Phase-change memory | Pierre Morin, Philippe Brun | 2019-09-03 |
| 9520334 | Integrated structure with improved heat dissipation | Pascal Ancey, Sandrine Lhostis | 2016-12-13 |
| 9455239 | Integrated circuit chip and fabrication method | Julien Cuzzocrea | 2016-09-27 |
| 9431373 | Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure | Rachid Taibi, Cedrick Chappaz, Lea Di Cioccio | 2016-08-30 |
| 9293429 | Electronic chip comprising connection pillars and manufacturing method | — | 2016-03-22 |
| 9136233 | Process for fabricating a three-dimensional integrated structure with improved heat dissipation, and corresponding three-dimensional integrated structure | — | 2015-09-15 |
| 9093456 | Stack of semiconductor structures and corresponding manufacturing method | — | 2015-07-28 |
| 9093505 | Integrated circuit chip and fabrication method | Julien Cuzzocrea | 2015-07-28 |
| 8980738 | Integrated circuit chip and fabrication method | Julien Cuzzocrea | 2015-03-17 |
| 8916393 | Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure | Rachid Taibi, Cedrick Chappaz, Lea Di Cioccio | 2014-12-23 |
| 8907481 | Stack of semiconductor structures and corresponding manufacturing method | — | 2014-12-09 |
| 8896121 | Chip assembly system | — | 2014-11-25 |
| 8890276 | Three-dimensional integrated structure capable of detecting a temperature rise | — | 2014-11-18 |
| 8860186 | Method for manufacturing an integrated circuit comprising vias crossing the substrate | Mohamed Bouchoucha | 2014-10-14 |
| 8766381 | Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element | Fabrice Casset, Lionel Cadix, Perceval Coudrain, Alexis Farcy, Yacine Felk +1 more | 2014-07-01 |
| 8726736 | Method for determining the local stress induced in a semiconductor material wafer by through vias | Mohamed Bouchoucha, Pascal Chausse | 2014-05-20 |
| 8674517 | Method of assembling two integrated circuits and corresponding structure | Mohamed Bouchoucha | 2014-03-18 |
| 8673740 | Method for formation of an electrically conducting through via | Julien Cuzzocrea | 2014-03-18 |
| 8518802 | Process for fabricating integrated-circuit chips | Julien Cuzzocrea | 2013-08-27 |
| 8466038 | Process for fabricating integrated-circuit chips | Julien Cuzzocrea | 2013-06-18 |