Perceval Coudrain — 14 Patents at Stmicroelectronics Sa

Perceval Coudrain has been granted 14 US patents while listed as an inventor at Stmicroelectronics Sa. The first was granted in 2011 and the most recent in March 2025. Perceval Coudrain ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Perceval Coudrain in Grenoble, FR.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12249572	Integrated structure with bifunctional routing and assembly comprising such a structure	Candice THOMAS, Jean Charbonnier, Maud Vinet	2025-03-11
11823997	Chip with bifunctional routing and associated method of manufacturing	Candice THOMAS, Jean Charbonnier, Maud Vinet	2023-11-21
11152281	Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material	Louis-Michel Collin, Jean-Philippe Colonna, Luc Frechette	2021-10-19
10480833	Heat-transferring and electrically connecting device and electronic device	Rafael Augusto Prieto Herrera, Jean-Philippe Colonna	2019-11-19	$8,778,000
9997431	Electronic device provided with a thermal dissipation member	Rafael Augusto Prieto Herrera, Jean-Philippe Colonna	2018-06-12	$10,225,000
9870947	Method for collective (wafer-scale) fabrication of electronic devices and electronic device	Didier CAMPOS, Benoit Besancon, Jean-Philippe Colonna	2018-01-16	$21,025,000
9646914	Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure	Pierre Bar	2017-05-09	$7,299,000
9224708	Method for manufacturing a conducting contact on a conducting element	Jean-Philippe Colonna	2015-12-29
8828797	Process for assembling two parts of a circuit	Yacine Felk, Patrick Lamontagne	2014-09-09	$2,910,000
8766381	Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element	Fabrice Casset, Lionel Cadix, Alexis Farcy, Laurent-Luc Chapelon, Yacine Felk +1 more	2014-07-01	$3,341,000
8486817	Method for forming an integrated circuit level by sequential tridimensional integration	Philippe Coronel, Nicolas Buffet	2013-07-16	$3,169,000
8456258	Bulk acoustic wave resonator disposed on a substrate having a buried cavity formed therein providing different substrate thicknesses underneath the resonator	David Petit	2013-06-04	$4,265,000
8186568	Assembly of two parts of an integrated electronic circuit	Philippe Coronel, Pascale Mazoyer	2012-05-29	$5,157,000
7902621	Integrated circuit comprising mirrors buried at different depths	Philippe Coronel, Michel Marty, Matthieu Bopp	2011-03-08	$4,977,000

Perceval Coudrain — 14 Patents

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