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Integrated structure with bifunctional routing and assembly comprising such a structure |
Candice THOMAS, Jean Charbonnier, Maud Vinet |
2025-03-11 |
| 11823997 |
Chip with bifunctional routing and associated method of manufacturing |
Candice THOMAS, Jean Charbonnier, Maud Vinet |
2023-11-21 |
| 11152281 |
Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material |
Louis-Michel Collin, Jean-Philippe Colonna, Luc Frechette |
2021-10-19 |
| 10480833 |
Heat-transferring and electrically connecting device and electronic device |
Rafael Augusto Prieto Herrera, Jean-Philippe Colonna |
2019-11-19 |
| 9997431 |
Electronic device provided with a thermal dissipation member |
Rafael Augusto Prieto Herrera, Jean-Philippe Colonna |
2018-06-12 |
| 9870947 |
Method for collective (wafer-scale) fabrication of electronic devices and electronic device |
Didier CAMPOS, Benoit Besancon, Jean-Philippe Colonna |
2018-01-16 |
| 9646914 |
Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure |
Pierre Bar |
2017-05-09 |
| 9224708 |
Method for manufacturing a conducting contact on a conducting element |
Jean-Philippe Colonna |
2015-12-29 |
| 8828797 |
Process for assembling two parts of a circuit |
Yacine Felk, Patrick Lamontagne |
2014-09-09 |
| 8766381 |
Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element |
Fabrice Casset, Lionel Cadix, Alexis Farcy, Laurent-Luc Chapelon, Yacine Felk +1 more |
2014-07-01 |
| 8486817 |
Method for forming an integrated circuit level by sequential tridimensional integration |
Philippe Coronel, Nicolas Buffet |
2013-07-16 |
| 8456258 |
Bulk acoustic wave resonator disposed on a substrate having a buried cavity formed therein providing different substrate thicknesses underneath the resonator |
David Petit |
2013-06-04 |
| 8186568 |
Assembly of two parts of an integrated electronic circuit |
Philippe Coronel, Pascale Mazoyer |
2012-05-29 |
| 7902621 |
Integrated circuit comprising mirrors buried at different depths |
Philippe Coronel, Michel Marty, Matthieu Bopp |
2011-03-08 |
