Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249572 | Integrated structure with bifunctional routing and assembly comprising such a structure | Candice THOMAS, Jean Charbonnier, Maud Vinet | 2025-03-11 |
| 11823997 | Chip with bifunctional routing and associated method of manufacturing | Candice THOMAS, Jean Charbonnier, Maud Vinet | 2023-11-21 |
| 11152281 | Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material | Louis-Michel Collin, Jean-Philippe Colonna, Luc Frechette | 2021-10-19 |
| 10480833 | Heat-transferring and electrically connecting device and electronic device | Rafael Augusto Prieto Herrera, Jean-Philippe Colonna | 2019-11-19 |
| 9997431 | Electronic device provided with a thermal dissipation member | Rafael Augusto Prieto Herrera, Jean-Philippe Colonna | 2018-06-12 |
| 9870947 | Method for collective (wafer-scale) fabrication of electronic devices and electronic device | Didier CAMPOS, Benoit Besancon, Jean-Philippe Colonna | 2018-01-16 |
| 9646914 | Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure | Pierre Bar | 2017-05-09 |
| 9224708 | Method for manufacturing a conducting contact on a conducting element | Jean-Philippe Colonna | 2015-12-29 |
| 8828797 | Process for assembling two parts of a circuit | Yacine Felk, Patrick Lamontagne | 2014-09-09 |
| 8766381 | Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element | Fabrice Casset, Lionel Cadix, Alexis Farcy, Laurent-Luc Chapelon, Yacine Felk +1 more | 2014-07-01 |
| 8486817 | Method for forming an integrated circuit level by sequential tridimensional integration | Philippe Coronel, Nicolas Buffet | 2013-07-16 |
| 8456258 | Bulk acoustic wave resonator disposed on a substrate having a buried cavity formed therein providing different substrate thicknesses underneath the resonator | David Petit | 2013-06-04 |
| 8186568 | Assembly of two parts of an integrated electronic circuit | Philippe Coronel, Pascale Mazoyer | 2012-05-29 |
| 7902621 | Integrated circuit comprising mirrors buried at different depths | Philippe Coronel, Michel Marty, Matthieu Bopp | 2011-03-08 |