Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for collective (wafer-scale) fabrication of electronic devices and electronic device

Method for collective (wafer-scale) fabrication of electronic devices and electronic device

US Patent 9870947 · Granted Jan 16, 2018

Estimated economic value: $21,025,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interconnected stacked circuits2025
Integrated structure with bifunctional routing and assembly comprising such a st2025
Chip with bifunctional routing and associated method of manufacturing2023
Process for collectively curving a set of electronic chips2023
Method for manufacturing a cover for an electronic package and electronic packag2023
Electronic device comprising an electronic chip mounted on top of a support subs2022
Wafer-level process for curving a set of electronic chips2022
Electronic device comprising an integrated electromagnetic antenna2022
Interconnected stacked circuits2022
Method of manufacturing a cooling circuit on an integrated circuit chip using a 2021
Method of manufacturing a cooling circuit on an integrated circuit chip using a 2021
Method for manufacturing an encapsulation cover for an electronic package and el2021