Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Eric Guiot — 10 Patents

SOSoitec: 8 patents #35 of 259Top 15%
STS.O.I. Tec Silicon On Insulator Technologies: 2 patents #64 of 155Top 45%
CEA: 1 patents #3,381 of 7,956Top 45%
Bernin, FR: #10 of 60 inventorsTop 20%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Eric Guiot has been granted 10 US patents while listed as an inventor at Soitec. The first was granted in 2007 and the most recent in April 2025. Eric Guiot ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Eric Guiot in Bernin, FR.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12270123 Method for producing a substrate for the epitaxial growth of a layer of a galium-based III-N alloy 2025-04-08
12198983 Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC Ionut Radu, Hugo Biard, Christophe Maleville, Didier Landru 2025-01-14
11251321 Engineered substrate with embedded mirror Aurelie Tauzin, Thomas Signamarcheix, Emmanuelle Lagoutte 2022-02-15
10361326 Advanced CPV solar cell assembly process Cecile Aulnette, Rainer Krause, Frank Dimroth, Eric Mazaleyrat, Charlotte Drazek 2019-07-23
9954139 Multiple transfer assembly process Rainer Krause, Cecile Aulnette, Eric Mazaleyrat, Frank Dimroth 2018-04-24
9136113 Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type Didier Landru, Fabrice Gritti, Oleg Kononchuk, Christelle Veytizou 2015-09-15
8343850 Process for fabricating a substrate comprising a deposited buried oxide layer Fabrice Lallement 2013-01-01
8324072 Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure Christelle Veytizou, Fabrice Gritti, Oleg Kononchuk, Didier Landru 2012-12-04
7256103 Method for manufacturing a compound material wafer Thibaut Maurice, Phuong Nguyen 2007-08-14
7217639 Method of manufacturing a material compound wafer Thibaut Maurice 2007-05-15