Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387930 | Method and wafer processing furnace for forming an epitaxial stack of semiconductor epitaxial layers on a plurality of substrates | Dieter Pierreux, Kelly Houben, Wilco Verweij, Bert Jongbloed, Charles Dezelah | 2025-08-12 |
| 12362174 | Method and wafer processing furnace for forming an epitaxial stack on a plurality of substrates | Wilco Verweij, Bert Jongbloed, Dieter Pierreux, Kelly Houben, Rami Khazaka +4 more | 2025-07-15 |
| 12040229 | Method for forming a structure with a hole | Dieter Pierreux, Bert Jongbloed | 2024-07-16 |
| 11646204 | Method for forming a layer provided with silicon | Dieter Pierreux, Bert Jongbloed, Kelly Houben, Werner Knaepen, Wilco Verweij | 2023-05-09 |
| 11610775 | Method and apparatus for filling a gap | Viljami Pore, Werner Knaepen, Bert Jongbloed, Dieter Pierreux, Suvi Haukka +2 more | 2023-03-21 |
| 11594450 | Method for forming a structure with a hole | Dieter Pierreux, Bert Jongbloed | 2023-02-28 |
| 11501968 | Method for providing a semiconductor device with silicon filled gaps | Dieter Pierreux, Anna Trovato, Kelly Houben, Bert Jongbloed, Wilco Verweij | 2022-11-15 |
| 11230766 | Substrate processing apparatus and method | Dieter Pierreux, Cornelis Thaddeus Herbschleb, Werner Knaepen, Bert Jongbloed, Kelly Houben +3 more | 2022-01-25 |
| 10460932 | Semiconductor device with amorphous silicon filled gaps and methods for forming | Kelly Houben, Maarten Stokhof, Bert Jongbloed, Dieter Pierreux | 2019-10-29 |
| 10453685 | Forming semiconductor device by providing an amorphous silicon core with a hard mask layer | Kelly Houben, Maarten Stokhof, Bert Jongbloed, Dieter Pierreux, Werner Knaepen | 2019-10-22 |
| 9837271 | Process for forming silicon-filled openings with a reduced occurrence of voids | Cornelius A. van der Jeugd, Theodorus G.M. Oosterlaken, Frank Huussen | 2017-12-05 |
| 9812320 | Method and apparatus for filling a gap | Viljami Pore, Werner Knaepen, Bert Jongbloed, Dieter Pierreux, Suvi Haukka +2 more | 2017-11-07 |
| 9443730 | Process for forming silicon-filled openings with a reduced occurrence of voids | Cornelius A. van der Jeugd, Theodorus G.M. Oosterlaken | 2016-09-13 |
| 9343304 | Method for depositing films on semiconductor wafers | Frank Huussen, Gijs Dingemans | 2016-05-17 |
| 8507388 | Prevention of oxidation of substrate surfaces in process chambers | Rene de Blank | 2013-08-13 |
| 7718518 | Low temperature doped silicon layer formation | Peter Zagwijn, Theodorus Gerardus Maria Oosterlaken, Pamela Rene Fischer | 2010-05-18 |
| 7645486 | Method of manufacturing a silicon dioxide layer | Konstantin Bourdelle, Nicolas Daval, Ian Cayrefourcq, Marinus De Blank, Cornelius A. van der Jeugd | 2010-01-12 |