CM

Christophe Maleville

ST S.O.I. Tec Silicon On Insulator Technologies: 38 patents #4 of 155Top 3%
SO Soitec: 11 patents #29 of 259Top 15%
CEA: 9 patents #431 of 7,956Top 6%
SC Shin-Etsu Handotai Co.: 2 patents #282 of 679Top 45%
PS Peregrine Semiconductor: 1 patents #68 of 112Top 65%
NS National University Of Singapore: 1 patents #498 of 1,623Top 35%
AS Altatech Semiconductor: 1 patents #5 of 13Top 40%
📍 Lumbin, FR: #1 of 26 inventorsTop 4%
Overall (All Time): #43,583 of 4,157,543Top 2%
56
Patents All Time

Issued Patents All Time

Showing 26–50 of 56 patents

Patent #TitleCo-InventorsDate
7544058 Method for high-temperature annealing a multilayer wafer Walter Schwarzenbach, Vivien Renauld 2009-06-09
7465645 Method of detaching a layer from a wafer using a localized starting area Walter Schwarzenbach, Nadia Ben Mohamed 2008-12-16
7452584 Method of increasing the area of a useful layer of material transferred onto a support 2008-11-18
7413964 Method of revealing crystalline defects in a bulk substrate Patrick Reynaud, Oleg Kononchuk 2008-08-19
7300856 Process for detaching layers of material Walter Schwarzenbach 2007-11-27
7297611 Method for producing thin layers of semiconductor material from a donor wafer 2007-11-20
7294557 Method of increasing the area of a useful layer of material transferred onto a support 2007-11-13
7285471 Process for transfer of a thin layer formed in a substrate with vacancy clusters Eric Neyret 2007-10-23
7235461 Method for bonding semiconductor structures together Corinne Maunand Tussot, Olivier Rayssac, Sebastien Kerdiles, Benjamin Scarfogliere, Hubert Moriceau +1 more 2007-06-26
7229899 Process for the transfer of a thin film Hubert Moriceau, Michel Bruel, Bernard Aspar 2007-06-12
7190029 Preventive treatment method for a multilayer semiconductor wafer Eric Neyret 2007-03-13
7138344 Method for minimizing slip line faults on a semiconductor wafer surface Eric Neyret, Ludovic Ecarnot 2006-11-21
7138325 Method of manufacturing a wafer Emmanuel Arene 2006-11-21
7081399 Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations Eric Neyret, Nadia Ben Mohamed 2006-07-25
7071077 Method for preparing a bonding surface of a semiconductor layer of a wafer Corinne Maunand Tussot 2006-07-04
7049250 Heat treatment for edges of multilayer semiconductor wafers Eric Neyret 2006-05-23
7048867 Method of increasing the area of a useful layer of material transferred onto a support 2006-05-23
7022586 Method for recycling a substrate Fabrice Letertre, Thibaut Maurice, Carlos Mazure, Frederic Metral 2006-04-04
6987051 Method of making cavities in a semiconductor wafer Walter Schwarzenbach 2006-01-17
6941795 Method for evaluating particle concentrations in a clean room or machine mini-environment 2005-09-13
6939783 Preventive treatment method for a multilayer semiconductor wafer Eric Neyret 2005-09-06
6903032 Method for preparing a semiconductor wafer surface Eric Neyret 2005-06-07
6884697 Process for cleaving a wafer layer from a donor wafer Walter Schwarzenbach 2005-04-26
6853802 Heat treatment for edges of multilayer semiconductor wafers Eric Neyret 2005-02-08
6833314 Method of characterizing implantation of a species in a substrate by surface imaging Walter Schwarzenbach 2004-12-21