Issued Patents All Time
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8900971 | Bonded substrate and manufacturing method thereof | Tsuyoshi Ohtsuki, Wei Qu, Fumio Tahara, Yuuki Ooi | 2014-12-02 |
| 8877609 | Method for manufacturing bonded substrate having an insulator layer in part of bonded substrate | Tsuyoshi Ohtsuki, Wei Qu, Fumio Tahara, Yuuki Ooi | 2014-11-04 |
| 8703580 | Silicon on insulator (SOI) wafer and process for producing same | Atsuo Ito, Yoshihiro Kubota | 2014-04-22 |
| 8575722 | Semiconductor substrate having multilayer film and method to reuse the substrate by delaminating a porous layer | Tsuyoshi Ohtsuki, Toru Takahashi, Wei Qu | 2013-11-05 |
| 8551246 | Method for evaluating oxide dielectric breakdown voltage of a silicon single crystal wafer | Fumio Tahara, Tsuyoshi Ohtsuki, Takatoshi Nagoya | 2013-10-08 |
| 8236667 | Silicon on insulator (SOI) wafer and process for producing same | Atsuo Ito, Yoshihiro Kubota | 2012-08-07 |
| 7959731 | Method for producing semiconductor wafer | Isao Yokokawa, Hiroji Aga | 2011-06-14 |
| 7608548 | Method for cleaning a multilayer substrate and method for bonding substrates and method for producing a bonded wafer | Isao Yokokawa | 2009-10-27 |
| 7601613 | Manufacturing method of bonded wafer | — | 2009-10-13 |
| 7560313 | SOI wafer and method for producing the same | Hiroji Aga | 2009-07-14 |
| 7550309 | Method for producing semiconductor wafer | Isao Yokokawa, Nobuhiko Noto | 2009-06-23 |
| 7531425 | Method of fabricating bonded wafer | Masatake Nakano, Shinichi Tomizawa | 2009-05-12 |
| 7524744 | Method of producing SOI wafer and SOI wafer | Isao Yokokawa, Hiroji Aga, Kiyotaka Takano | 2009-04-28 |
| 7320929 | Method of fabricating SOI wafer | Hiroji Aga | 2008-01-22 |
| 7315064 | Bonded wafer and method of producing bonded wafer | Kiyoshi Demizu, Isao Yokokawa, Tadahiro Ohmi, Shigetoshi Sugawa | 2008-01-01 |
| 7235427 | Method for treating substrates for microelectronics and substrates obtained by said method | Thierry Barge, Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata | 2007-06-26 |
| 7176102 | Method for producing SOI wafer and SOI wafer | Hiroji Aga, Naota Tate, Susumu Kuwabara | 2007-02-13 |
| 7091107 | Method for producing SOI wafer and SOI wafer | Isao Yokokawa | 2006-08-15 |
| 7084046 | Method of fabricating SOI wafer | Isao Yokokawa | 2006-08-01 |
| 7052974 | Bonded wafer and method of producing bonded wafer | Kiyoshi Demizu, Isao Yokokawa, Tadahiro Ohmi, Shigetoshi Sugawa | 2006-05-30 |
| 6998329 | SOI wafer producing method, and wafer separating jig | Hiroji Aga, Hiroyuki Takahashi | 2006-02-14 |
| 6959854 | Production method for bonded substrates | Isao Yokokawa, Masatake Nakano | 2005-11-01 |
| 6902988 | Method for treating substrates for microelectronics and substrates obtained by said method | Thierry Barge, Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata | 2005-06-07 |
| 6900113 | Method for producing bonded wafer and bonded wafer | Masatake Nakano, Isao Yokokawa | 2005-05-31 |
| 6884696 | Method for producing bonding wafer | Hiroji Aga, Shinichi Tomizawa | 2005-04-26 |