Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6846718 | Method for producing SOI wafer and SOI wafer | Hiroji Aga, Naoto Tate, Susumu Kuwabara | 2005-01-25 |
| 6797632 | Bonded wafer producing method and bonded wafer | Masatake Nakano, Shinichi Tomizawa | 2004-09-28 |
| 6784494 | Production method for SOI wafer and SOI wafer | — | 2004-08-31 |
| 6720640 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Susumu Kuwabara, Naoto Tate, Masatake Nakano, Thierry Barge, Christophe Maleville | 2004-04-13 |
| 6716722 | Method of producing a bonded wafer and the bonded wafer | Jun-ichiro Furihata | 2004-04-06 |
| 6596610 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Susumu Kuwabara, Naoto Tate, Masatake Nakano, Thierry Barge, Christophe Maleville | 2003-07-22 |
| 6566233 | Method for manufacturing bonded wafer | Isao Yokokawa | 2003-05-20 |
| 6461939 | SOI wafers and methods for producing SOI wafer | Jun-ichiro Furihata, Norihiro Kobayashi, Shoji Akiyama | 2002-10-08 |
| 6372609 | Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method | Hiroji Aga, Naoto Tate | 2002-04-16 |
| 6362076 | Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment | Yukio Inazuki, Hiroji Aga, Norihiro Kobayashi | 2002-03-26 |
| 6312797 | Method for manufacturing bonded wafer and bonded wafer | Isao Yokokawa | 2001-11-06 |
| 6306730 | Method of fabricating an SOI wafer and SOI wafer fabricated by the method | Isao Yokokawa | 2001-10-23 |
| 6284628 | Method of recycling a delaminated wafer and a silicon wafer used for the recycling | Susumu Kuwahara, Hiroji Aga, Masae Wada | 2001-09-04 |
| 6284629 | Method of fabricating an SOI wafer and SOI wafer fabricated by the method | Isao Yokokawa, Naoto Tate | 2001-09-04 |
| 6245645 | Method of fabricating an SOI wafer | Isao Yokokawa | 2001-06-12 |
| 6239004 | Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer | Hiroji Aga, Masatake Nakano | 2001-05-29 |
| 6238990 | Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method | Hiroji Aga, Norihiro Kobayashi | 2001-05-29 |
| 6140210 | Method of fabricating an SOI wafer and SOI wafer fabricated thereby | Hiroji Aga, Yukio Inazuki | 2000-10-31 |
| 6004866 | Method for manufacturing bonded wafer and bonded wafer manufactured thereby | Masatake Nakano, Masahiro Sakai | 1999-12-21 |
| 5998281 | SOI wafer and method for the preparation thereof | Hiroji Aga, Masatake Katayama | 1999-12-07 |
| D414867 | Dental camera | Masahiko Moriwaki | 1999-10-05 |
| 5918139 | Method of manufacturing a bonding substrate | Katsuo Yoshizawa | 1999-06-29 |
| D409618 | Audio mixer | Yasuki Yamakawa, Masahiko Moriwaki, Yoshihiko Asai | 1999-05-11 |
| D398008 | Speaker box | Yasuki Yamakawa | 1998-09-08 |
| 5804494 | Method of fabricating bonded wafer | Masatake Katayama, Kazushi Nakazawa | 1998-09-08 |