Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566196 | Method for manufacturing bonded SOI wafer | Osamu Ishikawa, Kenji Meguro, Taishi WAKABAYASHI, Hiroyuki Oonishi | 2020-02-18 |
| 10529615 | Method for manufacturing a bonded SOI wafer and bonded SOI wafer | Kenji Meguro, Taishi WAKABAYASHI | 2020-01-07 |
| 10490440 | Method for manufacturing bonded SOI wafer | Hiroji Aga | 2019-11-26 |
| 10424484 | Method for manufacturing a bonded SOI wafer | Toru Ishizuka, Masatake Nakano | 2019-09-24 |
| 10204824 | Method for producing SOI wafer | Isao Yokokawa, Hiroji Aga | 2019-02-12 |
| 9859149 | Method of producing bonded wafer with uniform thickness distribution | Hiroji Aga | 2018-01-02 |
| 9793154 | Method for manufacturing bonded SOI wafer | Hiroji Aga | 2017-10-17 |
| 9773694 | Method for manufacturing bonded wafer | Hiroji Aga | 2017-09-26 |
| 9735045 | Method of fabricating SOI wafer by ion implantation | Toru Ishizuka | 2017-08-15 |
| 9679800 | Method for manufacturing bonded wafer | Hiroji Aga | 2017-06-13 |
| 9240344 | Method for manufacturing SOI wafer | Hiroji Aga | 2016-01-19 |
| 9093497 | Method for manufacturing bonded SOI wafer | Toru Ishizuka, Hiroji Aga | 2015-07-28 |
| 9076840 | Method for manufacturing a bonded SOI wafer | Hiroji Aga, Isao Yokokawa, Toru Ishizuka, Masahiro Kato | 2015-07-07 |
| 8823130 | Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same | Masahiro Kato, Satoshi Oka, Tohru Ishizuka, Nobuhiko Noto | 2014-09-02 |
| 8697544 | Method for manufacturing bonded wafer | Tohru Ishizuka, Nobuhiko Noto | 2014-04-15 |
| 8466538 | SOI wafer, semiconductor device, and method for manufacturing SOI wafer | Tohru Ishizuka, Nobuhiko Noto, Masatake Nakano | 2013-06-18 |
| 8202787 | Method for manufacturing SOI wafer | Tohru Ishizuka, Hiroji Aga, Nobuhiko Noto | 2012-06-19 |
| 8173521 | Method for manufacturing bonded wafer | Hiroji Aga, Yasuo Nagaoka, Nobuhiko Noto | 2012-05-08 |
| 8097523 | Method for manufacturing bonded wafer | Tohru Ishizuka, Hiroji Aga, Nobuhiko Noto | 2012-01-17 |
| 7902042 | Method of manufacturing SOI wafer and thus-manufactured SOI wafer | Hiroji Aga, Masayuki Imai, Tatsuo Enomoto, Hiroshi Takeno | 2011-03-08 |
| 7890620 | Monitoring system and monitoring method | Mineyoshi Masuda, Tomohiro Morimura | 2011-02-15 |
| 7861421 | Method for measuring rotation angle of bonded wafer | Tohru Ishizuka, Nobuhiko Noto | 2011-01-04 |
| 7721295 | Execution multiplicity control system, and method and program for controlling the same | Yutaka Kudo, Futoshi Haga | 2010-05-18 |
| 7521334 | Method for producing direct bonded wafer and direct bonded wafer | Toru Ishizuka, Tomohiko Ohta, Hiroji Aga, Yasuo Nagaoka | 2009-04-21 |
| 7189293 | Method of producing annealed wafer and annealed wafer | Masaro Tamatsuka, Takatoshi Nagoya, Wei Qu, Hiroshi Takeno, Ken Aihara | 2007-03-13 |