Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566196 | Method for manufacturing bonded SOI wafer | Norihiro Kobayashi, Osamu Ishikawa, Kenji Meguro, Taishi WAKABAYASHI | 2020-02-18 |
| 8699236 | Conductive buffer material and display device | Kohji Hisakawa | 2014-04-15 |