Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496130 | Reclaiming processing method for delaminated wafer | Toru Ishizuka, Yuji Okubo, Takuya Sasaki, Akira Araki | 2016-11-15 |
| 8987109 | Method for manufacturing bonded wafer and bonded SOI wafer | Hiroji Aga, Isao Yokokawa | 2015-03-24 |
| 8823130 | Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same | Masahiro Kato, Satoshi Oka, Norihiro Kobayashi, Tohru Ishizuka | 2014-09-02 |
| 8697544 | Method for manufacturing bonded wafer | Tohru Ishizuka, Norihiro Kobayashi | 2014-04-15 |
| 8691665 | Method for producing bonded wafer | Satoshi Oka, Hiroji Aga, Masahiro Kato | 2014-04-08 |
| 8466538 | SOI wafer, semiconductor device, and method for manufacturing SOI wafer | Tohru Ishizuka, Norihiro Kobayashi, Masatake Nakano | 2013-06-18 |
| 8410573 | SOI (silicon on insulator) structure semiconductor device and method of manufacturing the same | Hiroshi Ohtsuki, Mitsutaka Katada, Hiroshi Takeno, Kazuhiko Yoshida | 2013-04-02 |
| 8389382 | Method for manufacturing bonded wafer | Satoshi Oka | 2013-03-05 |
| 8361888 | Method for manufacturing SOI wafer | Isao Yokokawa | 2013-01-29 |
| 8338277 | Method for manufacturing SOI substrate | Hiroshi Takeno, Tohru Ishizuka | 2012-12-25 |
| 8202787 | Method for manufacturing SOI wafer | Tohru Ishizuka, Norihiro Kobayashi, Hiroji Aga | 2012-06-19 |
| 8173521 | Method for manufacturing bonded wafer | Norihiro Kobayashi, Hiroji Aga, Yasuo Nagaoka | 2012-05-08 |
| 8097523 | Method for manufacturing bonded wafer | Norihiro Kobayashi, Tohru Ishizuka, Hiroji Aga | 2012-01-17 |
| 8076223 | Method for producing semiconductor substrate | Satoshi Oka | 2011-12-13 |
| 8053334 | Method for forming silicon oxide film of SOI wafer | Isao Yokokawa, Shin Yamaguchi | 2011-11-08 |
| 7985660 | Method for manufacturing soi wafer | Isao Yokokawa, Hiroshi Takeno | 2011-07-26 |
| 7861421 | Method for measuring rotation angle of bonded wafer | Norihiro Kobayashi, Tohru Ishizuka | 2011-01-04 |
| 7838388 | Method for producing SOI substrate | Satoshi Oka | 2010-11-23 |
| 7799660 | Method for manufacturing SOI substrate | Tohru Ishizuka, Hiroshi Takeno | 2010-09-21 |
| 7776719 | Method for manufacturing bonded wafer | Yasutsugu Soeta | 2010-08-17 |
| 7749861 | Method for manufacturing SOI substrate and SOI substrate | Hiroshi Takeno | 2010-07-06 |
| 7553685 | Method of fabricating light-emitting device and light-emitting device | Masato Yamada, Shinji Nozaki, Kazuo Uchida, Hiroshi Morisaki | 2009-06-30 |
| 7550309 | Method for producing semiconductor wafer | Isao Yokokawa, Kiyoshi Mitani | 2009-06-23 |
| 7041529 | Light-emitting device and method of fabricating the same | Masato Yamada, Jun-ya Ishizaki, Kazunori HAGIMOTO, Shinji Nozaki, Kazuo Uchida +1 more | 2006-05-09 |
| 6995401 | Light emitting device and method of fabricating the same | Masato Yamada, Masanobu Takahashi, Kingo Suzuki, Shinji Nozaki, Kazuo Uchida +1 more | 2006-02-07 |