YS

Yasutsugu Soeta

SC Shin-Etsu Handotai Co.: 3 patents #210 of 679Top 35%
Overall (All Time): #1,567,283 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7776719 Method for manufacturing bonded wafer Nobuhiko Noto 2010-08-17
7677957 Polishing apparatus, method for providing and mounting a polishing pad in a polishing apparatus, and method for producing a substrate using the polishing apparatus 2010-03-16
7591713 Polishing pad, method for processing polishing pad, and method for producing substrate using it 2009-09-22