MN

Masatake Nakano

SC Shin-Etsu Handotai Co.: 17 patents #32 of 679Top 5%
Sharp Kabushiki Kaisha: 2 patents #5,184 of 10,731Top 50%
ST S.O.I. Tec Silicon On Insulator Technologies: 2 patents #64 of 155Top 45%
Overall (All Time): #236,699 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
11056381 Method for producing bonded SOI wafer Toru Ishizuka 2021-07-06
10460983 Method for manufacturing a bonded SOI wafer Taishi WAKABAYASHI, Kenji Meguro, Shinichiro Yagi, Tomosuke Yoshida 2019-10-29
10424484 Method for manufacturing a bonded SOI wafer Toru Ishizuka, Norihiro Kobayashi 2019-09-24
8466538 SOI wafer, semiconductor device, and method for manufacturing SOI wafer Tohru Ishizuka, Nobuhiko Noto, Norihiro Kobayashi 2013-06-18
7565186 Portable information processing apparatus Kazutaka Okuzako 2009-07-21
7531425 Method of fabricating bonded wafer Shinichi Tomizawa, Kiyoshi Mitani 2009-05-12
7359740 Portable information processing apparatus Kazutaka Okuzako 2008-04-15
7186628 Method of manufacturing an SOI wafer where COP's are eliminated within the base wafer 2007-03-06
6959854 Production method for bonded substrates Isao Yokokawa, Kiyoshi Mitani 2005-11-01
6900113 Method for producing bonded wafer and bonded wafer Isao Yokokawa, Kiyoshi Mitani 2005-05-31
6797632 Bonded wafer producing method and bonded wafer Kiyoshi Mitani, Shinichi Tomizawa 2004-09-28
6720640 Method for reclaiming delaminated wafer and reclaimed delaminated wafer Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Thierry Barge, Christophe Maleville 2004-04-13
6596610 Method for reclaiming delaminated wafer and reclaimed delaminated wafer Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Thierry Barge, Christophe Maleville 2003-07-22
6534384 Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphere Katsuo Yoshizawa 2003-03-18
6239004 Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer Hiroji Aga, Kiyoshi Mitani 2001-05-29
6004866 Method for manufacturing bonded wafer and bonded wafer manufactured thereby Kiyoshi Mitani, Masahiro Sakai 1999-12-21
5427052 Method and apparatus for production of extremely thin SOI film substrate Yutaka Ohta, Masatake Katayama, Takao Abe 1995-06-27
5376215 Apparatus for production of extremely thin SOI film substrate Yutaka Ohta, Masatake Katayama, Takao Abe 1994-12-27
5240883 Method of fabricating SOI substrate with uniform thin silicon film Takao Abe, Masatake Katayama, Akio Kanai, Konomu Ohki 1993-08-31