Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11965730 | Method for measuring film thickness distribution of wafer with thin films | Kevin Quinquinet, Philippe Gastaldo | 2024-04-23 |
| 10115580 | Method for manufacturing an SOI wafer | Hiroji Aga | 2018-10-30 |
| 9279665 | Method for measuring film thickness distribution | — | 2016-03-08 |
| 8981291 | Method for measuring film thickness of SOI layer of SOI wafer | — | 2015-03-17 |
| 8976369 | Method for evaluating thin-film-formed wafer | — | 2015-03-10 |
| 8741741 | Method for designing SOI wafer and method for manufacturing SOI wafer | — | 2014-06-03 |
| 8497187 | Method for manufacturing SOI wafer and SOI wafer | Satoshi Oka | 2013-07-30 |
| 8311771 | Inspection method of SOI wafer | — | 2012-11-13 |
| 7176102 | Method for producing SOI wafer and SOI wafer | Hiroji Aga, Naota Tate, Kiyoshi Mitani | 2007-02-13 |
| 6846718 | Method for producing SOI wafer and SOI wafer | Hiroji Aga, Naoto Tate, Kiyoshi Mitani | 2005-01-25 |
| 6720640 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Kiyoshi Mitani, Naoto Tate, Masatake Nakano, Thierry Barge, Christophe Maleville | 2004-04-13 |
| 6596610 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Kiyoshi Mitani, Naoto Tate, Masatake Nakano, Thierry Barge, Christophe Maleville | 2003-07-22 |
| 5321264 | Method for evaluating surface state of silicon wafer | Takao Abe | 1994-06-14 |