TI

Toru Ishizuka

SC Shin-Etsu Handotai Co.: 14 patents #39 of 679Top 6%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
NU Nihon University: 1 patents #43 of 233Top 20%
Overall (All Time): #292,416 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
11244852 Method for manufacturing bonded SOI wafer Setsuya Hama 2022-02-08
11056381 Method for producing bonded SOI wafer Masatake Nakano 2021-07-06
10600677 Method for manufacturing bonded SOI wafer Setsuya Hama 2020-03-24
10424484 Method for manufacturing a bonded SOI wafer Norihiro Kobayashi, Masatake Nakano 2019-09-24
9842763 Method for manufacturing bonded wafer Yuta Tamba, Eiichi Yamazaki 2017-12-12
9735045 Method of fabricating SOI wafer by ion implantation Norihiro Kobayashi 2017-08-15
9673085 Method for manufacturing SOI wafer Hiroji Aga 2017-06-06
9496130 Reclaiming processing method for delaminated wafer Yuji Okubo, Takuya Sasaki, Akira Araki, Nobuhiko Noto 2016-11-15
9378999 Method for manufacturing SOI wafer Hiroji Aga 2016-06-28
9337080 Method for manufacturing SOI wafer Hiroji Aga, Isao Yokokawa 2016-05-10
9093497 Method for manufacturing bonded SOI wafer Norihiro Kobayashi, Hiroji Aga 2015-07-28
9076840 Method for manufacturing a bonded SOI wafer Norihiro Kobayashi, Hiroji Aga, Isao Yokokawa, Masahiro Kato 2015-07-07
9029240 Method for manufacturing SOI wafer Hiroji Aga 2015-05-12
7534105 Occludator, face bow, occlusion-confirming system and temporomandibular joint-reproducing system Yoshinori Arai, Yutaka Akiyama, Hitoshi Tsunashima, Ayuta Yamada 2009-05-19
7521334 Method for producing direct bonded wafer and direct bonded wafer Norihiro Kobayashi, Tomohiko Ohta, Hiroji Aga, Yasuo Nagaoka 2009-04-21
7499573 Plant growing analyzing system and method Takanari Tanabata, Tomoko Shinomura, Masafumi Kanetomo 2009-03-03