Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11584037 | Wire saw apparatus and method for manufacturing wafer | Kazutoshi Mizushima, Toshiaki Otaka, Yuichi Shimizu | 2023-02-21 |
| 10730161 | Method for conditioning polishing pad and polishing apparatus | Taichi Yasuda, Masanao SASAKI, Takuya Sasaki, Kazumasa Asai | 2020-08-04 |
| 10434621 | Workpiece processing apparatus and workpiece processing method | Taichi Yasuda | 2019-10-08 |
| 10236191 | Wafer drying apparatus and method for drying a wafer | Taichi Yasuda | 2019-03-19 |
| 10166649 | Machining apparatus for workpiece | Taichi Yasuda | 2019-01-01 |
| 9931730 | Automatic handling apparatus with positioning pins | Taichi Yasuda | 2018-04-03 |
| 9728442 | Workpiece holding apparatus | Taichi Yasuda | 2017-08-08 |
| 9050698 | Manufacturing method of carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method of wafer | Taichi Yasuda | 2015-06-09 |
| 7902042 | Method of manufacturing SOI wafer and thus-manufactured SOI wafer | Hiroji Aga, Norihiro Kobayashi, Masayuki Imai, Hiroshi Takeno | 2011-03-08 |
| 5211794 | Wafer etching apparatus | Michito Sato, Shigeyoshi Nezu | 1993-05-18 |