Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11584037 | Wire saw apparatus and method for manufacturing wafer | Toshiaki Otaka, Tatsuo Enomoto, Yuichi Shimizu | 2023-02-21 |
| 6962521 | Edge polished wafer, polishing cloth for edge polishing, and apparatus and method for edge polishing | — | 2005-11-08 |
| 6884154 | Method for apparatus for polishing outer peripheral chamfered part of wafer | Nakaji Miura, Yasuhiro Sekine, Makoto Suzuki, Kazuya Tomii | 2005-04-26 |
| 6722954 | Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer | Takahiro Hashimoto | 2004-04-20 |