Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for assembling wafers by means of molecular adhesion

Process for assembling wafers by means of molecular adhesion

US Patent 8232130 · Granted Jul 31, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Structure for radio frequency applications2025
Method for manufacturing a substrate for a radiofrequency device2025
Method for manufacturing a substrate2025
Method for manufacturing a substrate2025
Method for manufacturing a semiconductor-on-insulator substrate2025
Process for producing a receiver substrate for a semiconductor-on-insulator stru2024
Method of mechanical separation for a double layer transfer2024
Method for transferring a piezoelectric layer onto a support substrate2024
Substrate for a temperature-compensated surface acoustic wave device or volume a2024
Substrate for a temperature-compensated surface acoustic wave device or volume a2024
Heterostructure and method of fabrication2024
Method for manufacturing a substrate for a radiofrequency filter2024